마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제22권1호
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  • Pages.35-41
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  • 2015
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

  • Kim, Yoo-Sun (Nano Packaging and Interconnect Lab. (NPIL), Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST)) ;
  • Zhang, Shuye (Nano Packaging and Interconnect Lab. (NPIL), Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST)) ;
  • Paik, Kyung-Wook (Nano Packaging and Interconnect Lab. (NPIL), Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST))
  • 투고 : 2015.03.19
  • 심사 : 2015.03.27
  • 발행 : 2015.03.30
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초록

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

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참고문헌

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피인용 문헌

  1. Effects of acrylic adhesives property and optimized bonding parameters on Sn 58Bi solder joint morphology for flex-on-board assembly vol.78, 2017, https://doi.org/10.1016/j.microrel.2017.08.009
  2. A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn–58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications vol.7, pp.12, 2017, https://doi.org/10.1109/TCPMT.2017.2761784
  3. Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications vol.6, pp.12, 2016, https://doi.org/10.1109/TCPMT.2016.2619878
  4. A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature vol.8, pp.3, 2018, https://doi.org/10.1109/TCPMT.2018.2790979
  5. Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi-Ag-Ti based solder vol.7, pp.1, 2020, https://doi.org/10.3934/matersci.2020.1.24