DOI QR코드

DOI QR Code

분자 동역학 계산을 통한 결정질 실리콘 태양전지 기판에 콜드 스프레이 전극 형성 시 발생되는 비정질 구리상에 대한 용융 온도 변화 연구

Melting Point of Amorphous Copper Phase on Crystalline Silicon Solar Cells During Cold Spray using Molecular Dynamics Calculations

  • 김수민 (고려대학교 신소재공학과) ;
  • 강병준 (고려대학교 신소재공학과) ;
  • 정수정 (고려대학교 신소재공학과) ;
  • 강윤묵 (고려대학교 그린스쿨대학원 에너지환경정책기술학과) ;
  • 이해석 (고려대학교 신소재공학과) ;
  • 김동환 (고려대학교 신소재공학과)
  • Kim, Soo Min (Department of Materials Science and Engineering, Korea University) ;
  • Kang, Byungjun (Department of Materials Science and Engineering, Korea University) ;
  • Jeong, Sujeong (Department of Materials Science and Engineering, Korea University) ;
  • Kang, Yoonmook (KU.KIST Green School, Graduate School of Energy-Environment Policy and Technology, Korea University) ;
  • Lee, Hae-seok (Department of Materials Science and Engineering, Korea University) ;
  • Kim, Donghwan (Department of Materials Science and Engineering, Korea University)
  • 투고 : 2015.04.15
  • 심사 : 2015.04.17
  • 발행 : 2015.06.30

초록

In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between silicon substrate and copper electrode was analyzed using morphology observation technic. SEM and TEM analysis were performed to analyze a crystallinity and distribution shape of heterogeneous copper phase. Molecular dynamics simulation was performed to calculate glass transition temperature of copper metal. In the result, amorphous copper phase was observed near interface between silicon substrate and metal electrode. The results of the molecular dynamics simulation show that an amorphous copper phase could be formed at a temperature below the melting point of copper because cold spraying resulted in a lower glass transition temperature.

키워드

참고문헌

  1. Singh, Harminder, T. S. Sidhu, and S. B. S. Kalsi. "Cold spray technology: future of coating deposition processes.", Fracture and Structural Integrity, 22, pp. 69-84, 2012.
  2. King, P. C., Bae, G., Zahiri, S. H., Jahedi, M., & Lee, C., "An experimental and finite element study of cold spray copper impact onto two aluminum substrates.", Journal of thermal spray technology, 19, 3, pp. 620-634, 2010. https://doi.org/10.1007/s11666-009-9454-7
  3. Assadi, H., Gärtner, F., Stoltenhoff, T., & Kreye, H., "Bonding mechanism in cold gas spraying.", Acta Materialia, 51, 15, pp. 4379-4394, 2003. https://doi.org/10.1016/S1359-6454(03)00274-X
  4. D.-Y. Kim, J.-J. Park, J.-G. Lee, D. Kim, S. J. Tark, S. Ahn, J. H. Yun, J. Gwak, K. H. Yoon and S. Chandra, "Cold Spray Deposition of Copper Electrodes on Silicon and Glass Substrates.", Journal of thermal spray technology, 22, 7, pp. 1092-1102, 2013. https://doi.org/10.1007/s11666-013-9953-4
  5. Alkhimov, A. P., V. F. Kosarev, and S. V. Klinkov, "The features of cold spray nozzle design.", Journal of thermal spray technology, 10, 2, pp. 375-381, 2001. https://doi.org/10.1361/105996301770349466
  6. Louzguine-Luzgin, D. V., Belosludov, R., Saito, M., Kawazoe, Y., Inoue, A., "Glass-transition behavior of Ni: Calculation, prediction, and experiment.", Journal of Applied physics, 104, 12, pp.123529, 2008. https://doi.org/10.1063/1.3042240