Polymer Science and Technology (한국고분자학회지:고분자과학과기술)
- Volume 26 Issue 1
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- Pages.40-46
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- 2015
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- 1225-0260(pISSN)
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- 2586-1476(eISSN)
Debonding Technologies and Application of Adhesive for Semiconductor Packaging Process
반도체 패키징 공정용 Debonding 기술 및 접착소재의 응용
- Lee, Seung-Woo (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Park, Cho-Hee
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Park, Ji-Won
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Lim, Dong-Hyuk
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Song, Jun-Yeob
(Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
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Lee, Jae-Hak
(Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
- Kim, Seung-Man (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
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Kim, Hyun-Joong
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University)
- Published : 2015.02.25
Abstract
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