참고문헌
- J. Y. Choi, D. W. Park and T. S. Oh, "Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications", J. Microelectron. Packag. Soc., 21(4), 125 (2014). https://doi.org/10.6117/kmeps.2014.21.4.125
- H. A. Oh, D. Park, K. S. Hahn and T. S. Oh, "Elastic Modulus of Locally Stiffness-variant Polydimethylsiloxane Substrates for Stretchable Electronic Packaging Applications", to be published in J. Microelectron. Packag. Soc. (2015).
- J. Y. Choi and T. S. Oh, "Flip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging", J. Microelectron. Packag. Soc., 20(4), 17 (2013). https://doi.org/10.6117/KMEPS.2013.20.4.017
- M. Gonzalez, B. Vandervelde, W. Chistianens, Y.-Y. Hsu, F. Iker, F. Bossuyt, J. Vanfleteren, O. van der Sluis and P. H. M. Timmermans, "Thermo-Mechanical Analysis of Flexible and Stretchable Systems", 11th International Conference of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Berlin, 1, Institute of Electrical and Electronics Engineers (2010).
- J. H. Ahn, H. Lee and S. H. Choa, "Technology of Flexible Semiconductor/Memory Device", J. Microelectron. Packag. Soc., 20(2), 1 (2013). https://doi.org/10.6117/kmeps.2013.20.2.001
- J. Xiao, A. Carlson, Z. J. Liu, Y. Huang, H. Jiang and J. A. Rogers, "Stretchable and Compressible Thin Films of Stiff Materials on Compliant Wavy Substrates", App. Phys. Lett., 93, 013109 (2008). https://doi.org/10.1063/1.2955829
- T. Loher, D. Manessis, R. Heinrich, B. Schmied, J. Vanfleteren, J. DeBaets, A. Ostmann and H. Reichl, "Stretchable Electronic Systems", Proc. 59th Electronic Components and Technology Conference (ECTC), San Diego, 893, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
- T. Sekitani, Y. Noguchi, K. Hata, T. Fukushima, T. Aida and T. Someya, "A Rubberlike Stretchable Active Matrix Using Elastic Conductors", Science, 321, 1468 (2008). https://doi.org/10.1126/science.1160309
- D. H. Kim, J. H. Ahn, W. M. Choi, H. S. Kim, T. H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu and J. A. Rogers, "Stretchable and Foldable Silicon Integrated Circuits", Science, 320, 507 (2008). https://doi.org/10.1126/science.1154367
- M. Gonzalez, F. Axisa, M. V. Bulcke, D. Brosteaux, B. Vandevelde and J. Vanfleteren, "Design of Metal Interconnects for Stretchable Electronic Circuits", Microelectron. Reliab., 48, 825 (2008). https://doi.org/10.1016/j.microrel.2008.03.025
- T. Sekitani, H. Nakajima, H. Maeda, T. Fukushima, T. Aida, K. Hata and T. Someya, "Stretchable Active-Matrix Organic Light-Emitting Diode Display Using Printable Elastic Conductors", Nature Mater., 8, 494 (2009). https://doi.org/10.1038/nmat2459
- J. H. Ahn and J. H. Je, "Stretchable Electronics: Materials, Architectures and Integrations", J. Phys. D: Appl. Phys., 45, 102001 (2012).
- D. H. Kim and J. A. Rogers, "Stretchable Electronics: Materials Strategies and Devices", Adv. Mater., 20, 4887 (2008). https://doi.org/10.1002/adma.200801788
- J. Y. Choi, D. H. Park and T. S. Oh, "Chip Interconnection Process for Smart Fabrics Using Flip-Chip Bonding of SnBi Solder", J. Microelectron. Packag. Soc., 19(3), 71 (2012). https://doi.org/10.6117/KMEPS.2012.19.3.071
- S. P. Lacour, S. Wagner, Z. Huang and Z. Suo, "Stretchable Gold Conductors on Elastomeric Substrates", Appl. Phys. Lett., 82, 2404 (2003). https://doi.org/10.1063/1.1565683
- Y. K. Son, J. E. Kim and I. Y. Cho, "Trends on Wearable Computer Technology and Market", Electronics and Telecommunications Trends, 23, 79 (2008).
- J. E. Kim, H. T. Jeong and I. Y. Cho, "Trend in Digital Clothing Technology", Electronics and Telecommunications Trends, 24, 20 (2009).
- S. W. Jung, J. S. Choi, J. B. Koo, C. W. Park, B. S. Na, J. Y. Oh, S. S. Lee and H. Y. Chu, "Stretchable Organic Thin-Film Transistors Fabricated on Elastomer Substrates Using Polyimide Stiff-Island Structures", ECS Solid State Lett., 4(1), P1 (2015). https://doi.org/10.1149/2.0011501ssl
- S. P. Lacour, S. Wagner, R. J. Narayan, T. Li and Z. Suo, "Stiff Subcritical Islands of Diamondlike Carbon for Stretchable Electronics", J. Appl. Phys., 100, 014913 (2006). https://doi.org/10.1063/1.2210170
- Y. Y. Hsu, C. Papakyrikos, M. Raj, M. Dalal, P. Wei, X. Wang, G. Hupport, B. Morey and R. Ghaffari, "Archipelago Platform for Skin-mounted Wearable and Stretchable Electronics", Proc. 64th Electronic Components and Technology Conference (ECTC), Orlando, 145, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2014).
- R. Li, M. Li, Y. Su, J. Song and X. Ni, "An Analytical Mechanics Model for the Island-Bridge Structure of Stretchable Electronics", Soft Matt., 9, 8476 (2013). https://doi.org/10.1039/c3sm51476e
- C. R. Barrett, A. S. Tetelman and W. D. Nix, "The Principles of Engineering Materials", pp.316-325, Prentice Hall, Inc., Englewood Cliffs (1973).
- S. Popovics, "Quantitative Deformation Model for Two-phase Composites Including Concrete", Mater. Struct., 20, 171 (1987). https://doi.org/10.1007/BF02472733
- S. Popovics and M. R. A. Erdey, "Estimation of the Modulus of Elasticity of Concrete-like Composite Materials", Mater. Struct., 3, 253 (1970).
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