마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제22권4호
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  • Pages.1-5
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  • 2015
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications

  • Sharma, Ashutosh (Dept. of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae-Pil (Dept. of Materials Science and Engineering, University of Seoul)
  • 투고 : 2015.08.13
  • 심사 : 2015.12.10
  • 발행 : 2015.12.30
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초록

In high temperature aircraft electronics, aluminium based brazing filler is the prime choice today. Aluminium and its alloys have compatible properties like weight minimization, thermal conductivity, heat dissipation, high temperature precipitation hardening etc. suitable for the aerospace industry. However, the selection of brazing filler for high temperature electronics requires high temperature joint strength properties which is crucial for the aerospace. Thus the selection of proper brazing alloy material, the composition and brazing method play an important role in deciding the final reliability of aircraft electronic components. The composition of these aluminium alloys dependent on the addition of the various elements in the aluminium matrix. The complex shapes of aluminium structures like enclosures, heat dissipaters, chassis for electronic circuitry, in avionics are designed from numerous individual components and joined thereafter. In various aircraft applications, the poor strength caused by the casting and shrinkage defects is undesirable. In this report the effect of various additional elements on Al based alloys and brazing fillers have been discussed.

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피인용 문헌

  1. Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications vol.37, pp.2, 2015, https://doi.org/10.5781/jwj.2019.37.2.2