Applied Microscopy

Korean Society of Microscopy (한국현미경학회)
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Technical Overview on the Electron Backscattered Diffraction Sample Preparation

  • Kim, Dong-Ik (High Temperature Energy Materials Research Center, Korea Institute of Science and Technology) ;
  • Kim, Byung-Kyu (High Temperature Energy Materials Research Center, Korea Institute of Science and Technology) ;
  • Kim, Ju-Heon (High Temperature Energy Materials Research Center, Korea Institute of Science and Technology)
  • Received : 2015.11.20
  • Accepted : 2015.12.03
  • Published : 2015.12.30
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Abstract

A technical overview on the various sample preparation methods for electron backscattered diffraction (EBSD) analysis is carried out. The mechanical polishing with colloidal silica finish, electro-chemical polishing, dual layer coating and ion beam milling are introduced for the common sample preparation methods for EBSD observation and some issues that are frequently neglected by the common EBSD users but should be considered to get a reliable EBSD data are discussed. This overview would be especially helpful to the people who know what EBSD technique is but do not get a reliable EBSD data because of difficulties in sample preparation.

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References

  1. Humphreys F J (1999) Determination of microtexture by EBSD at high spatial resolution in a FEGSEM. In: Proceedings of ICOTOM-12, ed. Szpunar JA, pp. 74-78, (NRC Research Press, Ottawa).
  2. Jung S J, Park S Y, Kim B K, Kwon B, Kim S K, Park H H, Kim D I, Kim J Y, Hyun D B, Kim J S, and Baek S H (2015) Hardening of Bi–Te based alloys by dispersing B4C nanoparticles. Acta Mater. 97, 68-74. https://doi.org/10.1016/j.actamat.2015.06.052
  3. Kim D I, Oh K H, Lee H C, Chang Y J, Sohn W S, and Jang J (2004) Characterization of crystallographic properties of SMC poly Si using electron backscattered diffraction. J. Microsc. 215, 121-126. https://doi.org/10.1111/j.0022-2720.2004.01360.x
  4. Kim D I, Paik J M, Joo Y C, Oh K H, Lee H C, and Dicks K (2002) Microtexture measurement of copper damascene line with EBSD. Mater. Sci. Forum 408-412, 529-534.
  5. Kim J H, Kim D I, Shim J H, and Yi K W (2013) Investigation into the high temperature oxidation of Cu-bearing austenitic stainless steel using simultaneous electron backscatter diffraction-energy dispersive spectroscopy analysis. Corros. Sci. 77, 397-402. https://doi.org/10.1016/j.corsci.2013.08.015
  6. Lassen N C K (1994) Automated Determination of Crystal Orientations from Electron Backscattering Patterns (Institut for Matematisk Modellering, Danmarks Tekniske Universitet, Lyngby).
  7. Muppidi T, Field D P, Sanchez Jr J E, and Woo C (2005) Barrier layer, geometry and alloying effects on the microstructure and texture of electroplated copper thin films and damascene lines. Thin Solid Films 471, 63-70. https://doi.org/10.1016/j.tsf.2004.04.057
  8. Schwartz A J, Kumar M, Adams B L, and Field D P (2010) Electron Backscatter Diffraction in Materials Science, 2nd Edition (Springer Science & Business Media, New York).
  9. Venables J A and Harland C J (1973) Electron back-scattering patterns: a new technique for obtaining crystallographic information in the scanning electron microscope. Phil. Mag. 27, 1193-1200. https://doi.org/10.1080/14786437308225827