참고문헌
- J. H. Kim, H. W. Kim, S. M., Park, N. E. Lee, J. Korean Phys. Soc., 52 (2008) 318. https://doi.org/10.3938/jkps.52.318
- N. C. Das, D. Khastgir, T. K. Chaki, A. Chakraborty, Composites. 31A (2000) 1069.
- K. Sasikumar, G. Suresh, K. A. Thomas, R. John, V. Natarajan,T. Mukundav, R. M. R. Vishnubhatla, Bull. Mater. Sci., 29 (2006) 637. https://doi.org/10.1007/s12034-006-0016-z
- Y. Yacubowicz, M. Narkis, Polymer Engin. Sci., 30 (1990) 459. https://doi.org/10.1002/pen.760300806
- D. Li, K. Goodwin, C. L. Yang, J. Mater. Sci., 43 (2008) 7121. https://doi.org/10.1007/s10853-008-3031-1
- G. X. Wang, N. Li, H.L. Hu, Y.C. Yu, Appl. Surf. Sci., 253 (2006) 480. https://doi.org/10.1016/j.apsusc.2005.12.106
- D. C. Weng, U. Landau, J. Electrochem. Soc., 142(8) (1995) 2598. https://doi.org/10.1149/1.2050060
- Technical report, Roxtec multi-cable transit devices: Applications and design practices, Roxtec, Sweden, (2014).
- S. Rosset, M. Niklaus, P. Dubois, H.R. Shea, Adv. Funct. Mater., 19 (2009) 470. https://doi.org/10.1002/adfm.200801218
- I. M. Graz, D. P. J. Cotton, S. P. Lacour, Appl. Phys. Lett., 94 (2009) 071902. https://doi.org/10.1063/1.3076103
- S. P. Lacour, J. Jones, S. Wagner, T. Li, Z. Suo, Proc. IEEE, 93 (2005) 1459. https://doi.org/10.1109/JPROC.2005.851502
- K. G. Keong, W. Sha, S. Malinov, J. Alloys Compd, 334 (2002) 192. https://doi.org/10.1016/S0925-8388(01)01798-4
- K. Hagiwara, J. Watanabe, H. Honma, Plating & Surface Finishing, 84(4) (1997) 74.
- I. Motizuki, K. Izawa, J. Watanabe, and H. Honma, Trans. IMF, 77 (1999) 41. https://doi.org/10.1080/00202967.1999.11871242
- IEEE Std. 299, IEEE Standard Method for Measuring the Effectiveness of Electromagnetic Shielding Enclosure, (1997).
피인용 문헌
- Preparation of conductive EPDM rubber sheets by electroless Ni-plating for electromagnetic interference shielding applications vol.25, pp.5, 2015, https://doi.org/10.6111/JKCGCT.2015.25.5.193