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Failure Mechanism Analysis of SAW Device under RF High Power Stress

RF 고전력 스트레스에 의한 SAW Device의 고장메카니즘 분석

  • 김영구 (한국전자통신연구원 사업화본부) ;
  • 김태홍 (한국전자통신연구원 사업화본부)
  • Received : 2014.09.12
  • Accepted : 2014.10.10
  • Published : 2014.10.31

Abstract

In this paper, the improved power durability test system and method for an reliability analysis of SAW device is proposed and the failure mechanism through failure analysis is analyzed. As a result of the failure analysis using microscope, SEM and EDX, the failure mechanism of the SAW device is electromigration due to joule heating under high current density and high temperature condition. The electromigration makes voids and hillocks in the IDT electrode and the voids and hillocks can lead to short circuit and open circuit faults, respectively, increasing the insertion loss of an SAW filter. The accelerated life testing of the SAW filter for 450MHz CDMA application using the proposed power durability test system and method is carried out. $B_{10}$ lifetime of the SAW filter using Eyring model and Weibull distribution is estimated as about 98,500 hours.

본 논문에서는 RF 고전력 스트레스에 의한 SAW 디바이스의 신뢰성 분석을 위하여 향상된 내전력 시험시스템 및 시험방법을 제안하고 고장분석을 통해 고장메카니즘을 분석하였다. 광학현미경, SEM(Scanning Electron Microscope) 및 EDX(Energy Dispersive X-ray Spectro-scopy)장비를 이용하여 고장 분석한 결과, SAW 디바이스의 고장메카니즘은 고전류 밀도 및 고온 조건에서 줄열에 의한 Electromigration으로 분석하였다. Electromigration은 IDT전극에 void와 hillock을 생성하고, 그 결과로 전극이 단락과 단선되어 삽입손실이 증가하는 것이다. 제안된 내전력 시험시스템과 방법을 이용하여 450MHz CDMA용 SAW 필터의 가속수명시험을 수행하고, 아이링 모델과 와이블 분포를 이용하여 SAW 필터의 $B_{10}$수명은 98,500시간으로 추정하였다.

Keywords

References

  1. J.S. Park, B.J. Jang, H.R, Oh, J.B. Lim, H.G. Jo, "Research Trends of Micro-Filter for Mobile Handsets," The Proc of the KIEES, Vol. 16, No. 4, pp. 24-37, Oct 2005.
  2. D.Y. Lee, "A Study on Analysis of Electrostatics Destruction of Electronic Equipment," The Journal of The Institute of Internet, Broadcasting and Communication(JIIBC), Vol. 10, No. 6, pp. 235-241, Sep 2010.
  3. M. Pekarcikova, M. Hofmann et. al, "Investigation of High Power Effects on Ti/Al and Ta-Si-N/Cu/Ta-Si-N Electrodes for SAW Devices," IEEE, Transactions on Ultrasonics, Ferroelectrics, and Frequency control, Vol. 52, No. 5, pp. 911-916, May 2005. https://doi.org/10.1109/TUFFC.2005.1503977
  4. Y. Satoh, T. Nishigara et. al, "SAW Duplexer Metalization for High Power Durability," in Proc. IEEE Ultrasonics Symp. , Vol. 1, pp. 17-26, 1998.
  5. Y.G. Kim, T.H. Kim, S.G. Kang and I.G. Choi, "A study on the reliability analysis of SAW device," in Proc. KICS Summer Conf., pp. 718, Jeju Island, Korea, June 2010.
  6. D. Young, A. Christou, "Failure mechanism models for electromigration," IEEE Transactions on Reliability, Vol. 43, No. 2, pp. 186-192, June 1994. https://doi.org/10.1109/24.294986
  7. A. Mettas, P. Vassiliou, "Modeling and analysis of time-dependent stress accelerated life data," in Proc. Annual Reliability and Maintainability Symp, pp. 343-348, Seattle, USA, Jan 2002.
  8. S.J. Almalki, S. Nadarajah, "A New Discrete Modified Weibull Distribution," IEEE Transactions on Reliability, Vol. 63, No. 1, pp. 68-80, Mar 2014. https://doi.org/10.1109/TR.2014.2299691
  9. J. H. Kim, D. G. Park and H. K. Han, "A Study on Selection of Distribution Function for Reliability Prediction Using Accelerated Life Test Data", JKAIS, Vol. 7, No. 3, pp. 393-397, 2006.