The Transactions of the Korean Institute of Electrical Engineers P (전기학회논문지P)

The Korean Institute of Electrical Engineers (대한전기학회)
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Throughput Analysis of Wireless Transmission Platform using Multiple Wireless Chips for M2M Networks

M2M 어플리케이션 지원을 위한 무선 결합 전송 플랫폼의 전송률 분석

  • 왕한호 (상명대학교 정보통신공학과) ;
  • 우중재 (한서대학교 전자공학과)
  • Received : 2014.03.27
  • Accepted : 2014.05.19
  • Published : 2014.09.01
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Abstract

Various M2M applications have different quality-of-service(QoS) requirements to be implemented practically. QoS requirements are normally data rate and delay constraint. However, there are limited number of wireless communication chip solutions which cannot support QoS requirements for all M2M application. Hence, aggregated usage of plural wireless communication chip solutions should be needed to implement M2M applications. In this paper, we consider the case that two wireless communication chips using random access protocol work together to transmit data of an M2M application. In such case, data rate and delay performance are mathematically analyzed. In our results, practical data rate can be improved from 2.5 to 7 times while delay constraints are satisfied if we simply use two wireless communication chips together.

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References

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