Transactions on Electrical and Electronic Materials

  • 제15권4호
  • /
  • Pages.217-220
  • /
  • 2014
  • /
  • 1229-7607(pISSN)
  • /
  • 2092-7592(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지
DOI QR코드

DOI QR Code

Effects of Cu Wire's Shape on the Plating Property of Sn-Pb Solder for Photovoltaic Ribbons

  • Cho, Tae-Sik (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Chae, Mun-Seok (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Cho, Chul-Sik (Laboratory, Sanko Korea Co.)
  • 투고 : 2014.04.25
  • 심사 : 2014.06.02
  • 발행 : 2014.08.25
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.

키워드

참고문헌

  1. D. M. Bagnall and M. Boreland, Energy Policy, 36, 4390 (2008) [DOI: http://dx.doi.org/10.1016/j.enpol.2008.09.070].
  2. R. Lathrop and K. Pfluke, Proc. of the 26th European Union Photovoltaic Solar Energy Conf., 1 (Hamburg, Germany, 2011).
  3. G. F. Wakefield, W. Hills, and Calif, Methode for Ribbon Solar Cell Fabrication, U.S. Patent, 4, 323, 419 (1982).
  4. J. Wendt, M. Trager, R. Klengel, M. Petzold, D. Schade, and R. Sykes, IEEE Intersociety Conference on Thermal and Thermomech- anical Phenomena in Electronic Systems, 1 (2010).
  5. J. S. Jeong, N. C. Park, and C. W. Han, Microelectronics Reliability, 52, 2326(2012) [DOI: http://dx.doi.org/10.1016/j.microrel.2012.06.027].
  6. Y. M. Chen, Y. P. Chiu, and H. W. Wu, Genetic Programming and Evolvable Mechanics, 1, 51(2012).
  7. K. Uehara and M. Sakurai, J. of Materials Processing Technology, 127, 178 (2002) [DOI: http://dx.doi.org/10.1016/S0924-0136(02)00122-X].
  8. J. Kim, K. S. Kim, and Y. H. Kim, J . of Adhesion Science and Technology, 3, 175 (1989) [DOI: http://dx.doi.org/10.1163/156856189X00146].
  9. B. J. Loveab and P. F. Packmanc, J. of Adhesion, 40, 139 (1993) [DOI: http://dx.doi.org/10.1080/00218469308031280].
  10. M. Sexsmith and T. Troczynski, J. of Thermal Spray Technology, 3, 404(1994) [DOI: http://dx.doi.org/10.1007/BF02658986].
  11. J. D. Bobyn, G. J. Wilson, D. C. MacGregor, R. M. Pilliar, and G. C. Weatherly, J. of Biomedical Materials Research, 16, 571 (1982) [DOI: http://dx.doi.org/10.1002/jbm.820160505].
  12. M. G. Chu, Y. Shiohara, and M. C. Flemings, Metallurgical transactions A, 15, 1303 (1984) [DOI: http://dx.doi.org/10.1007/BF02648558].
  13. J. H. Lee, Y. H. Lee, and Y. S. Kim, Scripta Meterialia, 42, 789 (2000) [DOI: http://dx.doi.org/10.1016/S1359-6462(99)00431-5].
  14. M. Schaefer, R. A. Fournelle, and J. Liang, J. of Electronic Materials, 27, 1167 (1998) [DOI: http://dx.doi.org/10.1007/s11664-998-0066-7].
  15. C. Y. Liu, C. Chen, and K. N. Tu, J. of Applied Physics, 88, 5703 (2000). http://dx.doi.org/10.1063/1.1319327].
  16. S. K. Kang, P. S. Rai, and S. Purushothaman, J. of Electronic Materials, 25, 1113 (1996) [DOI: http://dx.doi.org/10.1007/BF02659912].
  17. W. R. Osorio, E. S. Freitas, L. C. Peixoto, J. E. Spinelli, and A. Garcia, J. of Power Source, 207, 183 (2012) [DOI: http://dx.doi.org/10.1016/j.jpowsour.2012.01.060].
  18. B. S. Chiou, K. C. Liu, J. G. Duh, and P. S. Palanisamy, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 13, 267 (1990) [DOI: http://dx.doi.org/10.1109/33.56156].
  19. H. H. Manko, Solders and soldering (McGraw-Hill, New York, 2001), p.2-13,21-27.
  20. M. N. Islam, Y. C. Chan, M. J. Rizvi, and W. Jillek, J. of Alloys and Compounds, 400, 136 (2005) [DOI: http://dx.doi.org/10.1016/j.jallcom.2005.03.053].
  21. P. Schmitt, P. Kaiser, C. Savio, M. Tranitz, and U. Eitner, Energy Procedia, 27, 664 (2012) [DOI: http://dx.doi.org/10.1016/j.egypro.2012.07.126].
  22. H. K. Yeo and K. H. Han, J. of Alloys and Compounds, 477, 278 (2009).http://dx.doi.org/10.1016/j.jallcom.2008.10.150
  23. A. Wedi, D. Baither, and G. Schmitz, Scripta Materialia, 64, 689 (2011) [DOI: http://dx.doi.org/10.1016/j.scriptamat.2010.12.026
  24. A. W. Adamson and A. P. Gast, Physical Chemistry of Surfaces (John Wiley & Sons Inc., New York, 1997), p. 352-354.
  25. R. Tadmor, Langmuir, 20, 7659 (2004) [DOI: http://dx.doi.org/10.1021/la049410h].
  26. E. Chibowski and K. Terpilowski, Journal of Colloid and Interface Science, 319, 505 (2008) [DOI: http://dx.doi.org/10.1016/j.jcis.2007.10.059].
  27. P. G. de Gennes, Reviews of Modern Physics, 57, 827(1985) [DOI:http://dx.doi.org/10.1103/RevModPhys.57.827].
  28. W. A. Zisman, Contact Angle: Wettability, and Adhesion, (American Chem. Soc., 1964), p. 1-51 [DOI: http://dx.doi.org/10.1021/ba-1964-0043.ch001].
  29. M. A. Green, K. Emery, D. L. King, Y. Hishikawa, and W. Warta, Progress in Photovoltaic: Research and Applications, 15, 35 (2007) [DOI: http://dx.doi.org/10.1002/pip.741].
  30. L. L. Kazmerski, J. Elec. Spectroscopy and Related Phenomena, 150, 105 (2006) [DOI: http://dx.doi.org/10.1016/j.elspec.2005.09.004].
  31. P. V. Pesavento, R. J. Chesterfield, C. R. Newman, and C. D. Frisbie, J. of Applied Physics, 96, 7312 (2004) [DOI: http://dx.doi.org/10.1063/1.1806533].

피인용 문헌

  1. Effects of Ag on the Characteristics of Sn-Pb-Ag Solder for Photovoltaic Ribbon vol.28, pp.5, 2015, https://doi.org/10.4313/JKEM.2015.28.5.332