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Fabrication and Characteristics of a Varactor Diode for UHF TV Tuner Operated within Low Tuning Voltage

저전압 UHF TV 튜너용 바렉터 다이오드의 제작 및 특성

  • Kim, Hyun-Sik (School of Electronics Engineering, Kyungpook National University) ;
  • Moon, Young-Soon (Department of Sensor and Display Engineering, Kyungpook National University) ;
  • Son, Won-Ho (School of Electronics Engineering, Kyungpook National University) ;
  • Choi, Sie-Young (School of Electronics Engineering, Kyungpook National University)
  • 김현식 (경북대학교 IT대학 전자공학부) ;
  • 문영순 (경북대학교 일반대학 센서및디스플레이공학과) ;
  • 손원호 (경북대학교 IT대학 전자공학부) ;
  • 최시영 (경북대학교 IT대학 전자공학부)
  • Received : 2014.04.17
  • Accepted : 2014.05.27
  • Published : 2014.05.31

Abstract

The width of depletion region in a varactor diode can be modulated by varying a reverse bias voltage. Thus, the preferred characteristics of depletion capacitance can obtained by the change in the width of depletion region so that it can select only the desirable frequencies. In this paper, the TV tuner varactor diode fabricated by hyper-abrupt profile control technique is presented. This diode can be operated within 3.3 V of driving voltage with capability of UHF band tuning. To form the hyperabrupt profile, firstly, p+ high concentration shallow junction with $0.2{\mu}m$ of junction depth and $1E+20ions/cm^3$ of surface concentration was formed using $BF_2$ implantation source. Simulation results optimized important factors such as epitaxial thickness and dose quality, diffusion time of n+ layer. To form steep hyper-abrupt profile, Formed n+ profile implanted the $PH_3$ source at Si(100) n-type epitaxial layer that has resistivity of $1.4{\Omega}cm$ and thickness of $2.4{\mu}m$ using p+ high concentration Shallow junction. Aluminum containing to 1% of Si was used as a electrode metal. Area of electrode was $30,200{\mu}m^2$. The C-V and Q-V electric characteristics were investigated by using impedance Analyzer (HP4291B). By controlling of concentration profile by n+ dosage at p+ high concentration shallow junction, the device with maximum $L_F$ at -1.5 V and 21.5~3.47 pF at 0.3~3.3 V was fabricated. We got the appropriate device in driving voltage 3.3 V having hyper-abrupt junction that profile order (m factor) is about -3/2. The deviation of capacitance by hyper-abrupt junction with C0.3 V of initial capacitance is due to the deviation of thermal process, ion implantation and diffusion. The deviation of initial capacitance at 0.3 V can be reduced by control of thermal process tolerance using RTP on wafer.

Keywords

References

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