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Effect of Reactive Diluents on the AC Electrical Treeing in Epoxy/Nanosilicate Systems

  • Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
  • Received : 2014.01.22
  • Accepted : 2014.02.03
  • Published : 2014.04.25

Abstract

The effect of reactive diluents on the ac electrical treeing in epoxy/nanosilicate systems was studied, in a needle-plate electrode geometry. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and layered silicate was used as a nano-sized filler. Polyglycol (PG) or 1,4-butanediol diglycidyl ether (BDGE) was introduced as a reactive diluent to the DGEBA/nanosilicate system, in order to decrease the viscosity of the nanocomposite system. PG acted as a flexibilizer, and BDGE acted as a chain extender, after the curing reaction. To measure the treeing propagation rate, a constant alternating current (ac) of 10 kV/4.2 mm (60 Hz) was applied to the specimen, in a needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. When 10 kV/4.2 mm (60 Hz) was applied, the treeing propagate rate in the DGEBA system was $1.10{\times}10^{-3}$ mm/min, and that in the DGEBA/PG system was $1.05{\times}10^{-3}$ mm/min. As 1.5 wt% of nanosilicate was added to the DGEGA/PG system, the propagation rate was $0.33{\times}10^{-3}$ mm/min. This meant that the nano-sized layered silicates would act as good barriers to treeing propagation. The effect of chlorine content was also studied, and it was found that chlorine had a bad effect on the electrical insulation property of the epoxy system.

Keywords

References

  1. J. Y. Lee, M. J. Shim and S. W. Kim, Polym. Eng. Sci., 39, 1993 (1999) [DOI: http://dx.doi.org/10.1002/pen.11592].
  2. Y. S. Cho, M. J. Shim and S. W. Kim, Mater. Chem. Phys., 66, 70 (2000) [DOI: http://dx.doi.org/10.1016/S0254-0584(00)00272-8].
  3. R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: http://dx.doi.org/10.1016/j.msea.2006.09.077].
  4. P. O. Henk, T. W. Kortsen and T. Kvarts, High Perform. Polym., 11, 281 (1999) [DOI: http://dx.doi.org/10.1088/0954-0083/11/3/304].
  5. M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagheralavi, M. M. S. Shrazi and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
  6. P. Bajaj, N. K. Jha and A. Kumar, J. Appl. Polym. Sci., 56, 1339 (1995) [DOI: http://dx.doi.org/10.1002/app.1995.070561015].
  7. Y. Xu, D. D. L. Chung and C. Mroz, Composites: Part A, 32, 1749 (2001) [DOI: http://dx.doi.org/10.1016/S1359-835X(01)00023-9].
  8. A. A. Wazzan, H. A. Al-Turaif and A. F. Abdelkader, Polymer- Plastics Technology and Engineering, 45, 1155 (2006) [DOI: http://dx.doi.org/10.1080/03602550600887285].
  9. T. Tanaka, G. C. Montanari and R. Mulhaupt, IEEE Trans. Dielectr. Electr. Insul., 11, 763 (2004) [DOI: http://dx.doi.org/10.1109/TDEI.2004.1349782].
  10. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, Intern. Sympos. Electr. Insulating Materials, Kitakyushu, Japan, pp. 239 (2005).
  11. J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: http://dx.doi.org/10.1109/TDEI.2010.5595553].
  12. D. J. Suh and O. O. Park, J. Appl. Polym. Sci., 83, 2143 (2002) [DOI: http://dx.doi.org/10.1002/app.10166].
  13. J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: http://dx.doi.org/10.1109/TDEI.2010.5595553].
  14. J. J. Park, Trans. Electr. Electron. Mater., 14, 278 (2013) [DOI: http://dx.doi.org/10.4313/TEEM.2013.14.5.278].
  15. L. P. Witnauer, H. B. Knight, W. E. Palm, R. E. Koos, W. C. Ault, and D. Swern, Ind. Eng. Chem., 47, 2304 (1955) [DOI: http://dx.doi.org/10.1021/ie50551a034].