조명전기설비학회논문지 (Journal of the Korean Institute of Illuminating and Electrical Installation Engineers)

  • 제28권7호
  • /
  • Pages.19-25
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  • 2014
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  • 1229-4691(pISSN)
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  • 2287-5034(eISSN)
한국조명전기설비학회 (The Korean Institute of IIIuminating and Electrical Installation Engineers)
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CFD전산모사를 이용한 Al 6063 Heat Sink 최적화 설계와 열전도성 Polycarbonate와의 방열성능 비교 분석

Optimization of Al 6063 Heat Sink using CFD Simulation and Comparative Analysis of Thermal Dissipation Properties with Thermal Conductive Polycarbonate

  • 허인성 (부경대학교 LED-해양 융합기술 연구센터) ;
  • 이세일 (부경대학교 LED-해양 융합기술 연구센터) ;
  • 이아람 (부경대학교 LED-해양 융합기술 연구센터) ;
  • 유영문 (부경대학교 LED-해양 융합기술 연구센터)
  • Her, In-Sung (Pukyoung National University, LED-Marine Convergence Technology R&BD Center) ;
  • Lee, Se-Il (Pukyoung National University, LED-Marine Convergence Technology R&BD Center) ;
  • Lee, A-Ram (Pukyoung National University, LED-Marine Convergence Technology R&BD Center) ;
  • Yu, Young Moon (Pukyoung National University, LED-Marine Convergence Technology R&BD Center)
  • 투고 : 2014.04.09
  • 심사 : 2014.06.17
  • 발행 : 2014.07.31
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초록

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

키워드

참고문헌

  1. Moo-Whan Shin and Jae-Pil Kim, "LED Introduction packaging technology", Bookshill, pp. 283, 2009.
  2. Seung-Min Lee, Se-Il Lee, Jong-Kyung Yang, Jong-Chan Lee and Dae-Hee Park, "Optimization of heat sink and Analysis of Thermal Property in 75W LED Module for Street Lighting", Trans. KIEE, Vol. 59, No. 3, pp. 609-613, 2010.
  3. S. L. Chuang, "Kinetic model for degradation of light-emitting diodes," IEEE J. Quant. Electron., Vol. 33, no. 6, pp. 970-979, Jun. 1997. https://doi.org/10.1109/3.585485
  4. N. Narendran, and Y. Gu, "Life of LED-based White Light sources", IEEE/OSA Journal of Display Technology, Vol. 1 No. 1, pp. 167-170, 2005. https://doi.org/10.1109/JDT.2005.852510
  5. Xiaobing Luo, Wei Xiong, Ting Cheng and Sheng Liu, "Design and Optimization of Horizontally-located Plate Fin Heat Sink for High Power LED Street Lamps", Electronic Components and Technology Conference, ECTC2009.59th, pp. 854-859, 2009.
  6. Se-Il Lee, Seung-Min Lee and Dae-Hee Park, "Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB", Trans. JIEIE, Vol. 24, No. 12, pp. 57-63, 2010. https://doi.org/10.5207/JIEIE.2010.24.12.057
  7. Hyeon-gyu An, "Prediction on Heat releasing Characteristics of Household LED Module and Heat sink Design", Master's Thesis in engineering, Kangwon National University Graduate School, 2011.
  8. Man-Seok Ko, Ju-Han Lee, Sang-June Oh, Hyen-Seok Cho and Tae-Beom Seo, "Cooling Performance of LED Head Lamp with Heat Sink and Cooling Fan", Trans. .KSME, Vol. 33, No. 12, pp. 933-1034, 2009. https://doi.org/10.3795/KSME-B.2009.33.12.947
  9. Frank P. Incropera, David P. DeWitt, "Fundamentals of heat and mass transfer", College of Engineering University of Notre Dame, 6th edition, pp. 1-11, 1996.
  10. Frank P. Incropera, David P. DeWitt, "Fundamentals of heat and mass transfer", College of Engineering University of Notre Dame, 6th edition, pp. 166-168, 1996.