Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Ultrasound Assisted Sn-Ag-Pd Activation Process for Electroless Copper Plating

무전해 동 도금을 위한 초음파 적용 주석-은-팔라듐 활성화 공정에 대한 연구

  • Lee, Chang-Myeon (Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology) ;
  • Hur, Jin-Young (Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology) ;
  • Lee, Hong-Kee (Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology)
  • 이창면 (한국생산기술연구원, 인천지역본부, 표면처리연구실용화그룹) ;
  • 허진영 (한국생산기술연구원, 인천지역본부, 표면처리연구실용화그룹) ;
  • 이홍기 (한국생산기술연구원, 인천지역본부, 표면처리연구실용화그룹)
  • Received : 2014.10.23
  • Accepted : 2014.12.16
  • Published : 2014.12.31
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Abstract

An ultrasound-assisted Sn-Ag-Pd activation method for electroless copper plating was presented in this study. With this activation process, it was shown that the fine catalyst particles were homogeneously distributed with high density on the entire specimen. In addition, it was observed that incubation period occurred during the electroless plating step was decreased owing to the absorption of Ag which holds high catalytic activity. Resulting from the refinement and high densification of catalyst, the defect-free gap-fill was achieved within the 20x nm trench.

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References

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