References
- R. Viswanath, V. Wakharkar, A. Watwe, and V. Lebonheur, Intel Technol. J., Q3, 1 (2000).
- D. D. L. Chung, Appl. Therm. Eng., 21, 1593 (2001). https://doi.org/10.1016/S1359-4311(01)00042-4
- W. C. Oh, W. B. Ko, and F. J. Zhang, Elastom. Compos., 45, 80 (2010).
- E. J. Park, J. Lee, D. Jung, and S. E. Shim, Elastom. Compos., 45, 17 (2010).
- W. K. Jang, J. Yun, H. I. Kim, and Y. S. Lee, Carbon Lett., 12, 162 (2011). https://doi.org/10.5714/CL.2011.12.3.162
- M. T. Kim and K. Y. Rhee, Carbon Lett., 12, 177 (2011). https://doi.org/10.5714/CL.2011.12.3.177
- S. H. Kim, S. R. Choi, and D. Kim, J. Heat Trans-T ASME, 129, 298 (2007). https://doi.org/10.1115/1.2427071
- W. Zhou, S. Qi, C. Tu, H. Zhao, C. Wang, and J. Kou, J. Appl. Polym. Sci., 104, 1312 (2007). https://doi.org/10.1002/app.25789
- L. C. Sim, S. R. Ramanan, H. Ismail, K. N. Seetharamu, and T. J. Goh, Thermochim. Acta, 430, 155 (2005). https://doi.org/10.1016/j.tca.2004.12.024
- W. Zhou, S. Qi, Q. An, H. Zhao, and N. Liu, Mater. Res. Bull., 42, 1863 (2007). https://doi.org/10.1016/j.materresbull.2006.11.047
- W. Yu, H. Xi, L. Chen, and Y. Li, Thermochim. Acta, 491, 92 (2009). https://doi.org/10.1016/j.tca.2009.03.007
- S. V. N. T. Kuchibhatla, A. S. Karakoti, D. Bera, and S. Seal, Prog. Mater. Sci., 52, 699 (2007). https://doi.org/10.1016/j.pmatsci.2006.08.001
- B. B. Parekh, G. Fanchini, G. Eda, and M. Chhowalla, Appl. Phys. Lett., 90, 121913/1 (2007).
- P. Bonnet, D. Sireude, B. Garnier, and O. Chauvet, Appl. Phys. Lett., 91, 201910/1 (2007).
- C. Lu and Y. W. Mai, J. Mater. Sci., 43, 6012 (2008). https://doi.org/10.1007/s10853-008-2917-2
- Y. Xu, C. K. Leong, and D. D. L. Chung, J. Electro. Mater., 36, 1181 (2007). https://doi.org/10.1007/s11664-007-0188-3
- M. B. Bryning, D. E. Milkie, M. F. Islam, M. Kikkawa, and A. G. Yodh, Appl. Phys. Lett., 87, 161909/1 (2005).
- H. Huang, C. Liu, Y. Wu, and S. Fan, Adv. Mater., 17, 1652 (2005). https://doi.org/10.1002/adma.200500467
- P. C. Song, C. H. Liu, and S. S. Fan, Appl. Phys. Lett., 88, 153111/1 (2006).
- W. T. Hong and N. H. Tai, Diam. Relat. Mater., 17, 1577 (2008). https://doi.org/10.1016/j.diamond.2008.03.037
- C. H. Liu and S. S. Fan, Appl. Phys. Lett., 86, 123106/1 (2005).
- J. Hong, J. Lee, C. K. Hong, and S. E. Shim, Curr. Appl. Phys., 10, 359 (2010). https://doi.org/10.1016/j.cap.2009.06.028
- R. Prasher, Proc. IEEE, 94, 1571 (2006). https://doi.org/10.1109/JPROC.2006.879796
- W. Y. Zhou, S. H. Qi, H. Z. Zhao, and N. L. Liu, Polym. Compos., 28, 123 (2007).
- J. Hong, J. Lee, C. K. Hong, and S. E. Shim, J. Therm. Anal. Calorim., 101, 297 (2010). https://doi.org/10.1007/s10973-009-0664-5
- S. Y. Yang, C. C. M. Ma, C. C. Teng, Y. W. Huang, S. H. Liao, Y. L. Huang, H. W. Tien, T. M. Lee, and K. C. Chiou, Carbon, 48, 592 (2010). https://doi.org/10.1016/j.carbon.2009.08.047
- O. Meincke, D. Kaempfer, H. Weickmann, C. Friedrich, M. M. Vathauer, and H. Warth, Polymer, 45, 739 (2004). https://doi.org/10.1016/j.polymer.2003.12.013
- J. E. Fischer, H. Dai, A. Thess, R. Lee, N. N. Hanjani, D. L. Dehaas, and R. E. Smalley, Phys. Rev. B, 55, R4921 (1997). https://doi.org/10.1103/PhysRevB.55.R4921
- H. H. Horowitz and G. Metzger, Anal. Chem., 35, 1464 (1963). https://doi.org/10.1021/ac60203a013
- I. G. Popovic and L. Katsikas, Mater. Technol., 40, 7 (2006).
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