한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제26권11호
  • /
  • Pages.810-815
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  • 2013
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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실리카 충진된 실리콘 고무의 유전 특성에 관한 연구

A Study on the Dielectric Properties of Silicone Rubber Filled with Silica

  • 이성일 (한국교통대학교 안전공학과)
  • Lee, Sung Ill (Department of Safety Engineering, Korea National University of Transportation)
  • 투고 : 2013.10.15
  • 심사 : 2013.10.24
  • 발행 : 2013.11.01
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초록

In this study, the capacitance and dielectric loss tangent of the silicone rubber which is combined with filler (30 phr~50 phr) have been measured on the range of 100 Hz~100 kHz and $30{\sim}170^{\circ}C$. It was found that when the frequency is 0.1 kHz~100 kHz and the silicone rubber is combined with 30 phr to 50 phr of filler, the capacitance of silicone rubber has increased by about 28.6 pF to 33 pF in 30 phr of filler, about 20 pF to 46.1 pF in 40 phr of filler and about 36.4 pF to 44 pF in 50 phr of filler. It seems that the volume of dielectric loss has gradually increased due to the temperature rise and the rotating of dipole in electric field through the electric dipole generated by the Si-O group which is induced by adding of filler, or the carbonyl group which is caused by oxidation. It seems that the dielectric dispersion in 0.1 kHz is caused by molecular motion of Siloxane group in main chain, and the dielectric dispersion in 10 kHz is caused by molecular motion of Methyl group in side chain.

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참고문헌

  1. R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng., A445, 567 (2007)
  2. N. Hayakawa, H. Maeda, S. Chigusa, and H. Okubo, Cryogenics, 40, 167 (2000). https://doi.org/10.1016/S0011-2275(00)00024-2
  3. G. Iyer, R. S. Gorur, R. Richert, A Krivda, and L. E. Schmidt, IEEE Trans. Dielectr. Electr. Insul., 18, 659 (2011). https://doi.org/10.1109/TDEI.2011.5931050
  4. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, S Kuge, M. Kozako, and T. Tanaka, IEEJ Trans. FM, 126, 1136 (2006). https://doi.org/10.1541/ieejfms.126.1136
  5. R. J. Morgan, L. T. Mones, and W. J. Steele, Polymer, 23, 295 (1982). https://doi.org/10.1016/0032-3861(82)90320-2
  6. J. J. Park C. H. Lee, J. Y. Lee, and H. D. Kim, IEEE Trans. Dielectr. Electr. Insul., 18, 667 (2011). https://doi.org/10.1109/TDEI.2011.5931051
  7. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako, and T. Tanaka, Proc. of International Symposium on Electrical Insulating Materials, 5-9 (Kitakyushu, Japan, 2005) p. 239.
  8. P. Gonon, A. Sylvestre, J. Teysseyre, and C. Prior, J. Mater. Sci: Mater. in Electro., 12, 81 (2001).
  9. G. Chen, J. Zhao, S. Li, and L Zhong, Appl. Phys. Lett., 100, 222904 (2012). https://doi.org/10.1063/1.4721809