한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제46권4호
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  • Pages.168-174
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  • 2013
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지
DOI QR코드

DOI QR Code

유도 결합 플라즈마-스퍼터 승화법을 이용한 고분자 전해질 연료전지 분리판용 CrN 박막의 내식성연구

Anti-corrosion Properties of CrN Thin Films Deposited by Inductively Coupled Plasma Assisted Sputter Sublimation for PEMFC Bipolar Plates

  • 유영군 (군산대학교 공과대학 신소재공학과, 플라즈마 소재 응용 센터) ;
  • 주정훈 (군산대학교 공과대학 신소재공학과, 플라즈마 소재 응용 센터)
  • You, Younggoon (Department of Materials Science and Engineering, Plasma Materials Research Center Kunsan National University) ;
  • Joo, Junghoon (Department of Materials Science and Engineering, Plasma Materials Research Center Kunsan National University)
  • 투고 : 2013.08.20
  • 심사 : 2013.08.27
  • 발행 : 2013.08.31
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초록

In this study, low-cost, high-speed deposition, excellent processability, high mechanical strength and electrical conductivity, chemical stability and corrosion resistance of stainless steel to meet the obsessive-compulsive (0.1 mm or less) were selected CrN thin film. new price reduction to sputter deposition causes - the possibility of sublimation source for inductively coupled plasma Cr rods were attempts by DC bias. 0.6 Pa Ar inductively coupled plasmas of 2.4 MHz, 500 W, keeping Cr Rod DC bias power 30 W (900 V, 0.02 A) is applied, $N_2$ flow rate of 0.5, 1.0, 1.5 sccm by varying the characteristics of were analyzed. $N_2$ flow rate increases, decreases and $Cr_2N$, CrN was found to increase. In addition to corrosion resistance and contact resistance, corrosion resistance, electrical conductivity was evaluated. corrosion current density than $N_2$ 0 sccm was sure to rise in all, $N_2$ 1 sccm at $4.390{\times}10^{-7}$ (at 0.6 V) $A{\cdot}cm^{-2}$, respectively. electrical conductivity process results when $N_2$ 1 sccm 28.8 $m{\Omega}/cm^2$ with the lowest value of the contact resistance was confirmed that came out. The OES (SQ-2000) and QMS (CPM-300) using a reactive deposition process to add $N_2$ to maintain a uniform deposition rate was confirmed that.

키워드

참고문헌

  1. Y. Chiba, T. Omura, H. Ichimura, J. Mater. Res., 8 (1993) 1109. https://doi.org/10.1557/JMR.1993.1109
  2. D. D. Wang, T. Oki, Thin Solid Films, 185 (1990) 219. https://doi.org/10.1016/0040-6090(90)90086-S
  3. J. K. Lee, J. H. Uh, J. Ind. Technol. Res. Inst., Soonchunhyang, 3(3) (1997) 1343.
  4. J. Choi, J. Joo, The Korean Institute of Surface Engineering, 45(2) (2012) 75. https://doi.org/10.5695/JKISE.2012.45.2.075
  5. H. S. Choi, D. H. Han, W. H. Hong, J. J. Lee, J. Power Sources, 189 (2009) 966. https://doi.org/10.1016/j.jpowsour.2008.12.060
  6. D. Rosen, I. Katardjiev, S. Berg, W. Moller, Nuclear Instruments and Methods in Physics Research B, 228 (2005) 193. https://doi.org/10.1016/j.nimb.2004.10.044
  7. M. Hala, J. Capek, O. Zabeida, J. E. Klemberg-Sapieha, L. Martinu, Surf. Coat. Technol., 206 (2012) 4186. https://doi.org/10.1016/j.surfcoat.2012.04.019
  8. J. Lin, N. Zhang, W. D. Sproul, J. J. Moore, Surf. Coat. Technol., 206 (2012) 3283. https://doi.org/10.1016/j.surfcoat.2012.01.033
  9. N. Mubumbila, P.-Y. Tessier, B. Angleraud, G. Turban, Surf. Coat. Technol., 151-152 (2002) 175. https://doi.org/10.1016/S0257-8972(01)01569-9
  10. Jianliang Lin,William D. Sproul, John J. Moore, Sabrina Lee, Sterling Myers, Surf. Coat. Technol. 205 (2011) 3226. https://doi.org/10.1016/j.surfcoat.2010.11.039
  11. A. Vyas, Y. G. Shen, Z. F. Zhou, K. Y. Li, Compos. Sci. Technol., 68 (2008) 2922. https://doi.org/10.1016/j.compscitech.2007.11.002
  12. J. Mawdsley, J. David Carter, S. Niyogi, X. Wang, Annual Progress Report, (2011) 867.
  13. D. H. Seo, S. Y. Chun, The Korean Institute of Surface Engineering, 45(3) (2012) 123. https://doi.org/10.5695/JKISE.2012.45.3.123
  14. H. S. Jang, University of Ulsan, (2008) 1.

피인용 문헌

  1. Plasma Uniformity Analysis of Inductively Coupled Plasma Assisted Magnetron Sputtering by a 2D Voltage Probe Array vol.23, pp.4, 2014, https://doi.org/10.5757/ASCT.2014.23.4.161
  2. Numerical Modeling of an Inductively Coupled Plasma Sputter Sublimation Deposition System vol.23, pp.4, 2014, https://doi.org/10.5757/ASCT.2014.23.4.179