한국고분자학회지:고분자과학과기술 (Polymer Science and Technology)
- 제24권3호
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- Pages.277-284
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- 2013
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- 1225-0260(pISSN)
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- 2586-1476(eISSN)
3D 멀티칩 패키징용 Temporary Bonding & Debonding 접착소재
Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging
- Lee, Seung-Woo (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Park, Cho-Hee
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Park, Ji-Won
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Lim, Dong-Hyuk
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Kim, Hyun-Joong
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
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Song, Jun-Yeob
(Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
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Lee, Jae-Hak
(Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials)
- 발행 : 2013.06.25