Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging

3D 멀티칩 패키징용 Temporary Bonding & Debonding 접착소재

  • Lee, Seung-Woo (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
  • Park, Cho-Hee (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
  • Park, Ji-Won (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
  • Lim, Dong-Hyuk (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
  • Kim, Hyun-Joong (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
  • Song, Jun-Yeob (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
  • Lee, Jae-Hak (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials)
  • Published : 2013.06.25