Polymer Science and Technology (한국고분자학회지:고분자과학과기술)
- Volume 24 Issue 3
- /
- Pages.277-284
- /
- 2013
- /
- 1225-0260(pISSN)
- /
- 2586-1476(eISSN)
Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging
3D 멀티칩 패키징용 Temporary Bonding & Debonding 접착소재
- Lee, Seung-Woo (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
-
Park, Cho-Hee
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
-
Park, Ji-Won
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
-
Lim, Dong-Hyuk
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
-
Kim, Hyun-Joong
(Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
-
Song, Jun-Yeob
(Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
-
Lee, Jae-Hak
(Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials)
- Published : 2013.06.25
Abstract
Keywords