Polymer Science and Technology (한국고분자학회지:고분자과학과기술)
- Volume 24 Issue 3
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- Pages.277-284
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- 2013
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- 1225-0260(pISSN)
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- 2586-1476(eISSN)
Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging
3D 멀티칩 패키징용 Temporary Bonding & Debonding 접착소재
- Lee, Seung-Woo (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
- Park, Cho-Hee (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
- Park, Ji-Won (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
- Lim, Dong-Hyuk (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
- Kim, Hyun-Joong (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
- Song, Jun-Yeob (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
- Lee, Jae-Hak (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials)
- Published : 2013.06.25
Abstract
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