References
- J. Neal, RF Micro Devices Extends Industry-Leading PowerStar Power Amplifier Module Portfolio,http://ir.rfmd.com/releasedetail.cfm?ReleaseID=401836 (2005).
- M. Baine, RF Micro Devices Inc. & Atmel Corporation Trend Analysis Report, http://www.sbwire.com/press-releases/rf-micro-devices-inc-atmel-corporation-trend-analysis-report-nasdaq-rfmd-nasdaq-atml-195418.htm(2013).
- J. C. Velasco, D. Bercovich, H. Long, O. K. Eriksson, M. O'Connor, P. M. Rizzi, R. Yaron, and P. Croy, MEF, 11 (2011).
- J. W. Son, H. O. Youn, K. Bae, S. Y. Sohn, and H.. M.. Kim, Hydrophobic Properties on RF-sputtered PTFE Films coated on UV-treated Glass Substrates (2003). https://doi.org/10.4313/JKEM.2010.23.1.006
- D. Y. Kim, K. C. Lee, and C. Lee, Laser-Induced Surface Modication of Silicon and PTFE: Enhancement of Copper Deposition on Silicon (2003).
- K. H. Yoon, D. H. Jung, B. D. Yang, J. H. Jang, and J. H. Kim, Preparation and Dielectric Characteristics of PTFE(Polytetrafluoroethylene) Composites for Microwave Circuit Board (2003). https://doi.org/10.4191/KCERS.2003.40.8.735
- A. J. Bur, Dielectric Properties of Polymers at Microwave Frequencies: A review, Polymer Review, 26, 963 (1985). https://doi.org/10.1016/0032-3861(85)90216-2
- A. David and S. S. Gwo, "Electrical Substrate Material," U. S. Patent 5,149,590 (1992).
- Wikipedia: Polytetrafluoroethylene, http://en.wikipedia.org/wiki /Polytetrafluoroethylene (2001).
- J. Krupka, IEEE, 54, 3995 (2006).
- I. Mhaidata, J. A. Mergosb, S. Hamilakisa, C. Kolliaa, Z. Loizosa, A. Tsolomitisa, and C. T. Dervos, Mat. Lett., 63, 2587 (2009). https://doi.org/10.1016/j.matlet.2009.09.016
- J. R. Carroll, L. W. McGinnis, T. L. Miller, and M. B. Norris, Glass Fiber Reinforced Fluoropolymeric Circuit Laminate, U. S. Patent 4,886,699 (1989).
- A. Sawada, J. Chem. Phys., 129, 064701 (2008). https://doi.org/10.1063/1.2965877