DOI QR코드

DOI QR Code

Miniaturization of Embedded Bandpass Filter in LTCC Multilayer Substrate for WiMAX Applications

  • Cho, Youngseek (Center for Advanced Electric Applications, Wonkwang University) ;
  • Choi, Seyeong (Department of Information and Communication Engineering, Wonkwang University)
  • 투고 : 2012.10.16
  • 심사 : 2013.02.18
  • 발행 : 2013.03.31

초록

A compact radio frequency (RF) bandpass filter (BPF) in low temperature co-fired ceramic (LTCC) is suggested for WiMAX applications. The center frequency ($f_0$) of the BPF is 5.5 GHz and its pass band or 3-dB bandwidth is 700 MHz to cover all the three major bands, low and middle unlicensed national information infrastructure (U-NII; 5.15-5.35 GHz), World Radiocommunication Conference (5.47-5.725 GHz), and upper U-NII/industrial, scientific, and medical (ISM) (5.725-5.85 GHz), for the WiMAX frequency band. A lumped circuit element design-the 5th order capacitively coupled Chebyshev BPF topology-is adopted. In order to design a compact RF BPF, a very thin ($43.18{\mu}m$) ceramic layer is used in LTCC substrate. An interdigital BPF is also designed in silicon substrate to compare the size and performance of the lumped circuit element BPF. Due to the high relative dielectric constant (${\varepsilon}_r$ = 11.9) of the silicon substrate, the quarter-wavelength resonator of the interdigital BPF can be reduced. In comparison to the 5th order interdigital BPF at $f_0$ = 5.5 GHz, the lumped element design is 24% smaller in volume and has 17 and 7 dB better attenuation characteristics at $f_0{\pm}0.75$ GHz.

키워드

참고문헌

  1. G. Wang, M. Van, F. Barlow, and A. Elshabini, "An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications," IEEE Microwave and Wireless Components Letters, vol. 15, no. 5, pp. 357-359, 2005. https://doi.org/10.1109/LMWC.2005.847711
  2. S. Sakhnenko, D. Orlenko, K. Markov, A. Yatsenko, B. Vorotnikov, G. Sevskiy, P. Heide, and M. Vossiek, "Low profile LTCC balanced filter based on a lumped elements balun for WiMAX applications," in Proceeding of the 2008 IEEE MTT-S International Microwave Symposium Digest, Atlanta: GA, pp. 1111-1114, 2008.
  3. K. O. Kim, T. Kim, H. Kim, and S. Yi, "Embedded duplexer implementation for WiMAX front-end module with organic package substrate," in Proceeding of the 2nd Electronics System-Integration Technology Conference, London, UK, pp. 497-500, 2008.
  4. S. G. Mao and Y. Z. Chueh, "Coplanar waveguide bandpass filters with compact size and wide spurious-free stopband using electromagnetic bandgap resonators," IEEE Microwave and Wireless Components Letters, vol. 17, no. 3, pp. 181-183, 2007. https://doi.org/10.1109/LMWC.2006.890461
  5. R. Kubo, H. Fujii, H. Kawamura, M. Takeuchi, K. Inoue, Y. Yoshino, T. Makino, and S. Arai, "Fabrication of 5 GHz band film bulk acoustic wave resonators using ZnO thin film," in Proceeding of the 2003 IEEE Symposium on Ultrasonic, Dresden, Germany, pp. 166-169, 2003.
  6. G. L. Matthaei, L. Young, and E. M. T. Jones, Microwave Filters, Impedance-Matching Networks, and Coupling Structures. New York, NY: McGraw-Hill, 1964.