Korean Chemical Engineering Research

The Korean Institute of Chemical Engineers (한국화학공학회)
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Gold Nanonetworks on a Flexible Polyimide Substrate

유연성 폴리이미드 기판 위의 금 나노망

  • Kim, Hyonwoong (Department of Chemical Engineering, Dankook University) ;
  • Baik, Kwang Hyeon (Department of Materials Science and Engineering, Hongik University) ;
  • Kim, Jihyun (Department of Chemical and Biological Engineering, Korea University) ;
  • Jang, Soohwan (Department of Chemical Engineering, Dankook University)
  • 김현웅 (단국대학교 화학공학과) ;
  • 백광현 (홍익대학교 재료공학부) ;
  • 김지현 (고려대학교 화공생명공학과) ;
  • 장수환 (단국대학교 화학공학과)
  • Received : 2012.12.13
  • Accepted : 2013.01.28
  • Published : 2013.04.01
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Abstract

By using a simple solution based method, gold nanonetworks which are randomly distributed gold nanowires arrays were synthesized. After APTMS (3-aminopropyltrimethoxysilane) treatment, adhesion of gold nanonetworks with 10-15 nm diameters to the substrate was greatly enhanced. Density of gold nanonetworks increased with number of coating, and uniformly coated nanonetworks were connected physically and electrically. Gold nanonetworks deposited on the flexible polyimide substrate shows constant electrical conductivity for physical bending of the substrate.

불규칙한 나노선의 모임인 금 나노망이 간단한 수용액 합성법을 통하여 합성되었다. 직경이 10~15 nm 크기의 금나노망은 APTMS (3-aminopropyltrimethoxysilane) 처리를 통하여 기판과의 접착력을 크게 향상시킬 수 있었다. 코팅횟수의 조절을 통하여 기판 위 금 나노망의 밀도 조절이 가능하였으며, 균일하게 코팅된 나노망은 물리적 및 전기적으로 서로 연결된 구조를 보였다. 유연성 PI(polyimide) 기판에 증착된 금 나노망은 구부리기 전, 후 및 구부렸다 편 상태에서 동일한 전기 전도성을 나타내었다.

Keywords

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