한국고분자학회지:고분자과학과기술 (Polymer Science and Technology)
- 제24권1호
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- Pages.10-16
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- 2013
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- 1225-0260(pISSN)
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- 2586-1476(eISSN)
반도체 패키징용 에폭시 소재 기술
The Epoxy Resin for the Semiconductor Packaging
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전현애
(한국생산기술연구원 경기기술본부) ;
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탁상용
(한국생산기술연구원 경기기술본부) ;
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김윤주
(한국생산기술연구원 경기기술본부) ;
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박수진
(한국생산기술연구원 경기기술본부) ;
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박숙연
(한국생산기술연구원 경기기술본부) ;
- 강경남 (한국생산기술연구원 경기기술본부) ;
- 박성환 (한국생산기술연구원 경기기술본부)
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Chun, Hyunaee
(Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
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Tak, Sang Yong
(Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
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Kim, Yunju
(Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
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Park, Su Jin
(Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
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Park, Sook Yeon
(Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Kang, Kyung Nam (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Park, Sung Hwan (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology)
- 발행 : 2013.02.25