Polymer Science and Technology (한국고분자학회지:고분자과학과기술)
- Volume 24 Issue 1
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- Pages.10-16
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- 2013
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- 1225-0260(pISSN)
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- 2586-1476(eISSN)
The Epoxy Resin for the Semiconductor Packaging
반도체 패키징용 에폭시 소재 기술
- Chun, Hyunaee (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Tak, Sang Yong (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Kim, Yunju (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Park, Su Jin (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Park, Sook Yeon (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Kang, Kyung Nam (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
- Park, Sung Hwan (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology)
- 전현애 (한국생산기술연구원 경기기술본부) ;
- 탁상용 (한국생산기술연구원 경기기술본부) ;
- 김윤주 (한국생산기술연구원 경기기술본부) ;
- 박수진 (한국생산기술연구원 경기기술본부) ;
- 박숙연 (한국생산기술연구원 경기기술본부) ;
- 강경남 (한국생산기술연구원 경기기술본부) ;
- 박성환 (한국생산기술연구원 경기기술본부)
- Published : 2013.02.25
Abstract
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