The Epoxy Resin for the Semiconductor Packaging

반도체 패키징용 에폭시 소재 기술

  • Chun, Hyunaee (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
  • Tak, Sang Yong (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
  • Kim, Yunju (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
  • Park, Su Jin (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
  • Park, Sook Yeon (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
  • Kang, Kyung Nam (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology) ;
  • Park, Sung Hwan (Gyeonggi Technology Service Division, Korea Institute of Industrial Technology)
  • 전현애 (한국생산기술연구원 경기기술본부) ;
  • 탁상용 (한국생산기술연구원 경기기술본부) ;
  • 김윤주 (한국생산기술연구원 경기기술본부) ;
  • 박수진 (한국생산기술연구원 경기기술본부) ;
  • 박숙연 (한국생산기술연구원 경기기술본부) ;
  • 강경남 (한국생산기술연구원 경기기술본부) ;
  • 박성환 (한국생산기술연구원 경기기술본부)
  • Published : 2013.02.25