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A Study on Copper hydroxide affecting the Curing and the Corrosion resistance of Electrocoating

수산화구리가 전착도막의 경화성과 내식성에 미치는 영향

  • Yang, Wonseog (School of Materials Science and Engineering, Inha University) ;
  • Hwang, Woonsuk (School of Materials Science and Engineering, Inha University)
  • 양원석 (인하대학교 신소재공학부) ;
  • 황운석 (인하대학교 신소재공학부)
  • Received : 2013.10.18
  • Accepted : 2013.10.29
  • Published : 2013.10.31

Abstract

Effects of copper hydroxide(II) on the curing and the corrosion resistance of electrocoating were investigated by MEK rubbing test, electrochemical impedance spectroscopy (EIS) and Thermo-gravimetric analysis (TGA). Curing performance of electrocoating was lowered with increasing the content of copper hydroxide(II) as evidenced by the MEK rub performance which decreased with increasing the content of copper hydroxide(II). This indicates copper hydroxide(II) affected the blocked isocyanate reaction in the coatings, by the decomposition of copper hydroxide(II) to CuO and $H_2O$ during reaction of isocyanate with nuclephiles. Corrosion resistance of coatings also decreased with the content of copper hydroxide. This reflects the higher barrier property in coatings with higher curing performance.

Keywords

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