Journal of Environmental Science International (한국환경과학회지)

The Korean Environmental Sciences Society (한국환경과학회)
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Low Temperature Effects on the Nitrification in a Nitrogen Removal Fixed Biofilm Process Packed with SAC Media

  • Jang, Se-Yong (Facility Devision, Pusan National University) ;
  • Byun, Im-Gyu (Institute for Environmental Technology and Industry, Pusan National University)
  • Received : 2012.10.15
  • Accepted : 2012.12.26
  • Published : 2013.01.31
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Abstract

A fixed biofilm reactor system composed of anaerobic, anoxic(1), anoxic(2), aerobic(1) and aerobic(2) reactor was packed with synthetic activated ceramic (SAC) media and adopted to reduce the inhibition effect of low temperature on nitrification activities. The changes of nitrification activity at different wastewater temperature were investigated through the evaluation of temperature coefficient, volatile attached solid (VAS), specific nitrification rate and alkalinity consumption. Operating temperature was varied from 20 to $5^{\circ}C$. In this biofilm system, the specific nitrification rates of $15^{\circ}C$, $10^{\circ}C$ and $5^{\circ}C$ were 0.972, 0.859 and 0.613 when the specific nitrification rate of $20^{\circ}C$ was assumed to 1.00. Moreover the nitrification activity was also observed at $5^{\circ}C$ which is lower temperature than the critical temperature condition for the microorganism of activated sludge system. The specific amount of volatile attached solid (VAS) on media was maintained the range of 13.6-12.5 mg VAS/g media at $20{\sim}10^{\circ}C$. As the temperature was downed to $5^{\circ}C$, VAS was rapidly decreased to 10.9 mg VAS/g media and effluent suspended solids was increased from 3.2 mg/L to 12.0 mg/L due to the detachment of microorganism from SAC media. And alkalinity consumption was lower than theoretical value with 5.23 mg as $CaCO_3$/mg ${NH_4}^+$-N removal at $20^{\circ}C$. Temperature coefficient (${\Theta}$) of nitrification rate ($20^{\circ}C{\sim}5^{\circ}C$) was 1.033. Therefore, this fixed film nitrogen removal process showed superior stability for low temperature condition than conventional suspended growth process.

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