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FE-Analysis of Hot Forming of Al Large Thick Plate for Spherical LNG Tank Considering Cooling Performance of Grid-Typed Die

격자형 금형의 냉각효과를 고려한 구형 LNG 탱크용 대형 알루미늄 후판의 열간성형해석

  • Lee, Jung-Min (Dongnam Regional Division, Kitech) ;
  • Lee, In-Kyu (National Core Research Center, Pusan National Univ.) ;
  • Kim, Dae-Soon (Industrial Technology Division, Hyundai Heavy Industries) ;
  • Kwon, Il-Keun (Industrial Technology Division, Hyundai Heavy Industries) ;
  • Lee, Seon-Bong (Faculty of Mechanical and Automotive Engineering, Keimyung Univ.) ;
  • Kim, Byung-Min (Department of Mechanical Engineering, Pusan National Univ.)
  • 이정민 (한국생산기술연구원 동남권지역본부) ;
  • 이인규 (부산대학교 하이브리드 소재솔루션협동과정) ;
  • 김대순 (현대중공업 산업기술소) ;
  • 권일근 (현대중공업 산업기술소) ;
  • 이선봉 (계명대학교 기계자동차공학과) ;
  • 김병민 (부산대학교 기계공학부)
  • Received : 2011.09.02
  • Accepted : 2012.03.19
  • Published : 2012.11.01

Abstract

A hot forming of large thick Al plate using a grid-type hybrid die is a process to make a shell plate for the production of a spherical LNG tank. This process is characterized by using a grid-typed die with an additional air cooling system for reducing the cooling time of the heated plate after hot forming. The process consists of the plate's feeding, heating, forming and cooling in detail and each of them is continuously performed along the rail. This paper was designed to propose the analytical and experimental methods for determining the convection and interfacial heat transfer coefficients required in hot forming analysis of Al plate. These values in the analysis are to reproduce numerically the cooling performance of grid-typed die and cooling device. Interfacial heat transfer was obtained from the heat transfer experiments for different pressures and inverse analysis method. To verify the efficiency of the coefficient values obtained from above methods, FE analysis and experiment of the hot spherical-forming process were conducted for a small-scaled model. The convection coefficient was also calculated from flow analysis of air released by cooling device within grid-typed die using ANSYS-CFX.

Keywords

References

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