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Development of silicone mold applying corrosive pattern of tactile system

촉감시스템의 부식패턴을 적용한 실리콘 금형 개발

  • Kim, Kwang-Hee (Division of Technical Innovation, Incheon Technopark) ;
  • Kim, Jeong-Sik (Division of Technical Innovation, Incheon Technopark)
  • 김광희 ((재)인천테크노파크 기술혁신본부) ;
  • 김정식 ((재)인천테크노파크 기술혁신본부)
  • Received : 2012.08.22
  • Accepted : 2012.09.06
  • Published : 2012.09.30

Abstract

In this study, the start-type molded material, silicone resin(RTV-3040) was used to develop a mold that is utilized for embossing pattern. After selecting a required pattern using the commercial package (Freeform), we examined whether this is applicable to components creating projective embossed side on the surface. We responded to products that require corrosive pattern, such as aluminum mold, by making the starting type when small amounts of components are developing. However, the development of silicone mold that is applied to corrosive pattern showed the possible reduction in time and cost.

본 연구에서는 시작형 몰드재료인 실리콘 레진(RTV-3040)을 이용하여 엠보패턴을 활용한 몰드금형 개발을 위한 것이며, 상용패키지(Freeform)를 사용하여 필요한 패턴을 선택 한 후 면에 투영 엠보 면을 만들어 부품에 적용 가능을 검토하였다. 소량의 부품 개발 시 부식패턴이 필요로 한 제품들은 알루미늄 금형과 같은 시작형을 제작하여 대응하였으나, 부식패턴을 적용한 실리콘 금형 개발로 시간단축 및 원가절감이 가능한 것으로 나타났다.

Keywords

References

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