Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Studies on Copper Pillar Bump with Trapezoidal Cross Section on the Top Surface for Reliability Improvement

사다리꼴 상부 단면을 갖는 구리기둥 범프의 신뢰성 향상에 대한 연구

  • Cho, Il-Hwan (Department of Electronic Engineering, Myong-Ji University)
  • 조일환 (명지대학교 전자공학과)
  • Received : 2012.04.04
  • Accepted : 2012.06.21
  • Published : 2012.07.01
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Abstract

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

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References

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