Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics

국방 전자장비의 무연솔더 접합 신뢰성 검증기준 개발 가이드라인

  • Hong, Won-Sik (Components and Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Goo, Gi-Young (Missile and Electronics Research Team, Defense Agency for Technology and Quality) ;
  • Hwang, Un-Hee (Missile and Electronics Research Team, Defense Agency for Technology and Quality)
  • 홍원식 (전자부품연구원 부품소재물리연구센터) ;
  • 구기영 (국방기술품질원 유도전자기술팀) ;
  • 황운희 (국방기술품질원 유도전자기술팀)
  • Published : 2012.06.30
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References

  1. Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003)
  2. Commission of the european communities, directives of the european parliament and of the council on waste electrical and electronic equipment (WEEE) (2008)
  3. IPC 9701, Performance test methods and qualification requirements for surface mount solder attachments (2002), 4
  4. Jaesseong Jeong, Chulmin Oh, Gi-Young Goo, Young- Ho Yoon, Un Hee Hwang and Won Sik Hong, "Reliability Validation Methodology for Implementation Pb-free Solder to Military Electronics", Journal of KWJS, 29-4 (2011) 373-382 (in Korean) https://doi.org/10.5781/KWJS.2011.29.4.373
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  7. W. S. Hong, W. S. Kim, S. H. Park and K. B. Kim : Polarization Behaviors of SnCu Pb-Free Solder Depending on the P, Ni, Addition, Korean Journal of Materials Research, 15-8 (2005), 528-535 (in Korean) https://doi.org/10.3740/MRSK.2005.15.8.528
  8. Shahrzd Salemi et all, Physics-of-Failure Based Handbook of Microelectronic Systems, RiAC & University of Maryland (2008), 84
  9. IPC/JEDEC-9703, Mechanical Shock Test Guidelines for Solder Joint Reliability, Annex D-suggestions for Selecting Sample Size (2009), 28
  10. C. Handwerker, J. Bath, E. Benedetto, E. Bradley, R. Gedney, T. Siewert, P. Snugovsky, J. Sohn: NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures, SMTAi Conference Proceeding, (2003), 664-669
  11. K. suganuma : Lead-free soldering in electronics, ISBN 0824741021, Marcel dekker Inc, USA, (2004)
  12. P. L. Martin, "Electronic Failure Analysis Handbook", McGRAW-HILL, New York (1999)
  13. W. S. Hong, W. S. Kim, N. C. Park and K. B. Kim, "Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement", Journal of KWS, 25-2 (2007), 184 (in Korean) https://doi.org/10.5781/KWJS.2007.25.2.016

Cited by

  1. Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics vol.31, pp.3, 2013, https://doi.org/10.5781/KWJS.2013.31.3.22