Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Adhesion Measurement Methods for Thin Films in Microelectronics

  • Published : 2012.06.30
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Abstract

Diagnosing and improving adhesion of advanced packaging and thin films is an essential part of the research and development in microelectronics. In this paper, the four-point bend test and the double cantilever beam test among various adhesion measurement methods are reviewed.

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References

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