CAE Analysis and Optimization of Injection Molding for a Mobile Phone Cover

휴대폰 커버 사출성형의 CAE 해석 및 최적화

  • 박기윤 (ED&C, LTD. 기술지원부) ;
  • 김현성 (금오공과대학교 기계공학부) ;
  • 강진현 (금오공과대학교 기계공학부) ;
  • 박종천 (금오공과대학교 기계공학부)
  • Published : 2012.04.30

Abstract

This paper deals with an CAE analysis and optimization of injection molding for a mobile phone cover. Two design goals are established in the optimization; one is to switch over the feed system from cold runner to hot runner for the purpose of reducing material costs, and the other is to minimize the warpage in order to improve product quality. By the full-factorial experiments for design parameters, we showed that the cold runner design could be changed to the hot runner design by replacing the current resin with a new resin of higher fluidity. In addition, we could significantly reduce the warpage of the cover product under the hot runner system by optimizing packing pressure and packing time.

Keywords

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