전기학회논문지 (The Transactions of The Korean Institute of Electrical Engineers)

  • 제61권6호
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  • Pages.916-921
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  • 2012
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  • 1975-8359(pISSN)
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  • 2287-4364(eISSN)
대한전기학회 (The Korean Institute of Electrical Engineers)
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실리카/고분자 복합체를 이용한 실란트 페이스트의 구조 및 물리적 특성

Structural and Physical Properties of Sealant Paste Prepared by Silica/Polymer Composites

  • 투고 : 2012.04.26
  • 심사 : 2012.05.24
  • 발행 : 2012.06.01
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초록

Sealant paste with silica immersed in cross-linked epoxy-acrylate polymer resin was prepared by thermal and UV curing process. The curing mechanism of polymer resin resulted from 2 functional groups of epoxy and acrylic structure. The properties of microstructure, thermal conductivity and mechanical strength were investigated for its various applications. The adhesion strength is increased by increasing the thermal curing time until 15 minutes, and curing efficiency is saturated over 20 minutes. The increase rate per day of pot life and viscosity is 4.8%, indicating it has excellent storage stability. It is found that the formulation of silica pastes can be applied to heavy industries, building materials, display and various industries.

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참고문헌

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피인용 문헌

  1. A Study on Properties of Thermal Insulation Board Prepared by Porous Silica Aerogel vol.61, pp.9, 2012, https://doi.org/10.5370/KIEE.2012.61.9.1362