마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제19권1호
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  • Pages.1-7
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  • 2012
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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전자패키지 신뢰성 평가기술의 개요

Introduction of Reliability Test Technology for Electronics Package

  • 투고 : 2012.03.05
  • 심사 : 2012.03.09
  • 발행 : 2012.03.31
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초록

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

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참고문헌

  1. Japan Society of Mechanical Engineers, http://www.jsme.or.jp.
  2. 電子実装における信頼性と関する硏究分科会, http://www.rc-epack.org/index.htm.
  3. Japan Institute of Electronics Packaging, http://www.e-jisso.jp/ index.html.
  4. D. P. Seraphim, R. Lasky and C. Y. Li, Principles of Electronic Packaging, McGraw-Hill, New York (1989).
  5. K. J. Lee, K. S. Kim and K. Suganuma, "Electro-migration Phenomenon in Flip-chip Packages" (In Korean), J. Microelectron. Packag. Soc., 17(4), 11 (2010).
  6. Japan Electronics & Information Technology Industries Association, "EIAJ-EDR-4704, Application Guide of the Accelerated Life Test for Semiconductor Device" (In Japanese), (2000).
  7. N. Lycoudes, "Pressure Temperature Humidity Bias Method and System for Corrosion Studies of Plastic Encapsulated Integrated Circuit", Proc. 23rd Annual Technical Meeting of the Institute of Environmental Sciences, LA, Institute of Environmental Sciences (1977).
  8. Japan Electronics & Information Technology Industries Association, "JEITA-ET-7407, Environmental and Endurance Test Methods for a CSP/BGA Package Mounting Condition" (In Japanese), (1999).
  9. H. Tanaka, "Actual Conditions and Challenges of Accelerated Test" (In Japanese), J. Japan Institute of Electronics Packaging, 13(7), 502 (2010). https://doi.org/10.5104/jiep.13.502
  10. R. Kawanaka, "Materials Accidents and Material Technology" (In Japanese), Proc. 21st Reliability Symposium, Tokyo, 17, Reliability Engineering Association of Japan (2008).
  11. F. Harada, "An Issue and Foresight for Accelerated Test in Reliability Engineering" (In Japanese), J. Reliability Engineering Association of Japan, 31(2), 101 (2009).
  12. IPC-SM-785, "Guidelines for Accelerated Reliability Testing for Surface Mount Solder Attachments", Association Connecting Electronics Industries, 13 (1992).
  13. IEC-60749-25, "Semiconductor devices-Mechanical and climatic test methods-Part 25:Temperature cycling", International Electro-technical Commission, (2003).
  14. H. Tanaka, "Reliability Testing Technique of Isotropically Conductive Adhesive Jisso" (In Japanese), J. Japan Institute of Electronics Packaging, 11(3), 231 (2008). https://doi.org/10.5104/jiep.11.231
  15. K. S. Kim, K. J. Lee, K. Suganuma and S. H. Huh, "Effect of Cl Content on Interface Characteristics of Isotropic Conductive Adhesives/Sn Plating Interface" (In Korean), J. Microelectron. Packag. Soc., 18(3), 33 (2011).
  16. A. Kobayashi, "Evaluating the CAF (Conductive Anodic Filament) Resistance of Multi-layered PWBs" (In Japanese), ESPEC Technology Report, 24, 3 (2006).

피인용 문헌

  1. Lifetime Predictions of Printed Circuit Boards under Biased HAST vol.36, pp.2, 2012, https://doi.org/10.5781/jwj.2018.36.2.1
  2. SMT assembly effects on organic substrate lifetime reduction vol.32, pp.3, 2012, https://doi.org/10.1108/ssmt-11-2019-0036