Journal of the Korea Academia-Industrial cooperation Society (한국산학기술학회논문지)

The Korea Academia-Industrial cooperation Society (한국산학기술학회)
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Implementation of Digital Desoldering System for Removing Lead-free Solder

무연 솔더 제거를 위한 디지털 디솔더링 시스템 구현

  • Oh, Kab-Suk (Dept. of Electronics Engineering, Tongmyong University)
  • Received : 2011.11.04
  • Accepted : 2012.01.05
  • Published : 2012.01.31
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Abstract

This paper deals with a digital Desoldering system for removing lead-free solder. We proposed a Desoldering system that is to cope with the changed work environment of the solder materials changing from lead solder to lead-free solder, we can be quickly stable to the set temperature, and continuous operation is possible. Proposed system consists of a Desoldering station and a Desoldering gun. For the PID temperature control, we designed the 8bit MCU peripheral circuit. We had a few experiments to confirm the performance of the proposed system, and compared with the specification of same kind of imports. As a result, proposed system than the imported products showed good performance as follows: the time to reach operating temperature is 11 seconds faster, ripple temperature variation is $1.5^{\circ}C$ lower, temperature recovery rate is about $0.14^{\circ}C$/sec faster.

본 논문은 무연 솔더를 제거하기 위한 디지털 디솔더링 시스템에 관하여 다룬다. 땜납의 모재가 유연납에서 무연납으로 변화된 작업환경에 대처하고, 설정온도에 빠르게 수렴하며 연속작업이 가능한 디솔더링 시스템을 제안한다. 제안 시스템은 디솔더링 스테이션과 디솔더링건으로 구성되며, PID 온도제어를 위한 주변회로는 8bit MCU를 중심으로 설계하였다. 제안 시스템의 성능을 확인하기 위하여 동종의 수입품과 성능을 비교한 결과, 제안시스템은 기존 시스템에 비해 작업온도 도달시간은 11초 빠르며, 리플온도의 변화량은 $1.5^{\circ}C$ 적고, 열 회복율은 약 $0.14^{\circ}C$/초 빠르게 나타남을 확인 하였다.

Keywords

References

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