전자부품의 고속 외관검사를 위한 시스템 설계

System Design for High-speed Visual Inspection of Electronic Components

  • 유승열 (한국기술교육대학교 기계공학부)
  • Yoo, Seungryeol (School of Mechanical Engineering, Korea University of Technology and Education)
  • 투고 : 2012.08.27
  • 심사 : 2012.09.17
  • 발행 : 2012.09.30

초록

Electronics in modern lives have become more miniaturized and precise. Multi Layered Ceramic Capacitor (MLCC) occupies 50% of electronic components consisting of electronics. This high volume of the production needs high speed and more precise machine performances. The dominate parts of the production equipments are the module transporting components and the visual inspection module. Most visual inspection has been off-line because of the image processing time. In this paper, a new image processing method is proposed to reduce thousands of matrix calculation for image processing and realize on-line high speed inspection.

키워드

참고문헌

  1. 김기순, 김기영, 김준식, "초소형 RF-chip inductor 의외관검사알고리즘에관한연구,"한국신호처리.시스템학회논문집, 1권, 1-1 호, pp. 89-96, 2000.
  2. 김한나, 강수민, 허경무,"BGA 솔더볼외관검사시스템개발,"정보및제어심포지엄논문집, pp. 57-59, 2010.
  3. Hong-Dar Lin., "Computer-aided visual inspection of surface defects in ceramic capacitor chips," Journal of Materials Processing Technology ,Vol. 189, Issues 1-6, pp. 19-25, July 2007. https://doi.org/10.1016/j.jmatprotec.2006.12.051
  4. 한종우, 최영규, "제지공정의실시간검출을위한영상기반웹검사시스템," 반도체디스플레이기술학회지, Vol. 9, No. 2, pp. 47-51, 2010.
  5. 김현진, 이인호, 박창준, 오원근,"WindowNT 기반의다중스레드를이용한 IC 리드프레임검사시스템,"대한전자공학회학술대회, 10(1), pp. 511-514, 1997..
  6. Slabaugh G, Boyes R, Yang X, "Multicore Image Processing with OpenMP," IEEE signal processing magazine, Vol. 27 No.2, pp. 134-138, 2011.
  7. 정영훈, "OpenMP 병렬프로그래밍," FREELEC, 2011.