Tribology and Lubricants

Korean Tribology Society (한국트라이볼로지학회)
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Measurement of Local Elastic Properties of Flip-chip Bump Materials using Contact Resonance Force Microscopy

접촉 공진 힘 현미경 기술을 이용한 플립 칩 범프 재료의 국부 탄성계수 측정

  • Kim, Dae-Hyun (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) ;
  • Ahn, Hyo-Sok (College of Business and Technology, Seoul National University of Science and Technology) ;
  • Hahn, Junhee (Korea Research Institute of Standards and Science)
  • 김대현 (서울과학기술대학교 NID융합기술대학원) ;
  • 안효석 (서울과학기술대학교 기술경영융합대학) ;
  • 한준희 (한국표준과학연구원)
  • Received : 2012.05.30
  • Accepted : 2012.07.08
  • Published : 2012.08.31
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Abstract

We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.

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