Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Precise Joining Technology on Flexible Substrate by Using Micro-bumps

미세 범프를 이용한 연성기반 정밀 접합 기술

  • Kim, Min-Su (University of Science and Technology, Dept. Electronic Packaging) ;
  • Lee, Chang-Woo (Korea Institute of Industrial Technology)
  • Published : 2012.10.30
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Abstract

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References

  1. Players, "Organic Electronics Forecasts 2005-2015", IDTec (2005)
  2. R. H. Reuss, B. R. Chalamala, A. Moussessian, "Macroelectronics: Perspectives on Technology and Applications", Proc. IEEE, 93(7), 1239 (2005) https://doi.org/10.1109/JPROC.2005.851237
  3. W. S. Wong and A. Salleo, Flexible Electronics, 1st Ed, pp.4-5, Springer (2009)
  4. J. Shen and Y. C .Chan, "Research advances in nano composite solders", Microelectron. Reliab., 49(3), 223 (2009) https://doi.org/10.1016/j.microrel.2008.10.004
  5. M. Y .Kim, S .K .Lim and T. S. Oh, "Thermal Cycling and High Temperature storage Reliabilities of the Flip Chip Hoints Processed Using Cu pillar Bumps", J. Microelectron. Packag. Soc, 17(3), 27 (2010)
  6. J. Y .Choi, M. Y .Kim, S .K .Kim, and T. S. Oh, "Flip Chip Process for RF Packages Using Joints Structures of Cu and Sn bumps", J. Microelectron. Packag. Soc, 16(3), 67 (2009)
  7. S. K. Kang, "Lead (Pb)-Free Solders for Electronic Packaging", J. Electron. Mater., 23(8), 701 (1994) https://doi.org/10.1007/BF02651362

Cited by

  1. Study on Joint of Micro Solder Bump for Application of Flexible Electronics vol.31, pp.3, 2013, https://doi.org/10.5781/KWJS.2013.31.3.4