Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effects of ZnO Composition on the Thermal Emission Properties for LTCC Type of High Power LED Package

고전력 LED용 적층형 LTCC 패키징의 ZnO 조성 변화가 방열 특성에 미치는 영향

  • Kim, Woojeong (Dept. of Advanced Materials Engineering, Korea Polytechnic University) ;
  • Kim, Hyung Soo (Dept. of Advanced Materials Engineering, Korea Polytechnic University) ;
  • Shin, Daegyu (Dept. of Advanced Materials Engineering, Korea Polytechnic University) ;
  • Lee, Hee Chul (Dept. of Advanced Materials Engineering, Korea Polytechnic University)
  • 김우정 (한국산업기술대학교 신소재공학과) ;
  • 김형수 (한국산업기술대학교 신소재공학과) ;
  • 신대규 (한국산업기술대학교 신소재공학과) ;
  • 이희철 (한국산업기술대학교 신소재공학과)
  • Received : 2012.08.31
  • Accepted : 2012.10.30
  • Published : 2012.12.30
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Abstract

LTCC (Low temperature co-fired ceramic) package have been paid much attention due its good reliability, miniaturization, and application of silver paste with complex wiring and printing. Therefore, LTCC package has been expected to replace vulnerable plastic package in the field of high power LED device. Currently, LTCC ceramic package is mainly made up of aluminum oxide powder. In this study, zinc oxide powder is added or replaced for the fabrication of LTCC ceramic body. By adding small amount of ZnO, thermal conductivity of the LTCC ceramic body could be remarkably increased by 25% leading to the extension of LED life time. The LTCC package structure with composition including ZnO has an increased thermal flux by 56% as a result of ANSYS simulation. Actually, the fabricated LED package with the addition of ZnO exhibits a decreased thermal resistivity by 14.9%.

신뢰성이 우수하며, 소형화가 가능하고, 우수한 열전도도의 은 전극을 이용할 수 있는 LTCC (Low temperature co-fired ceramic) 패키징은 환경 및 열에 약한 플라스틱 패키징을 대체할 것으로 기대받고 있다. 현재 LTCC 패키징의 원료 분말로는 주로 $Al_2O_3$을 사용하는데, 본 연구에서는 $Al_2O_3$보다 열전도도가 2배 우수한 ZnO을 일부 첨가 또는 대체한 조성 변화를 통하여 패키징의 열 특성 변화에 대해 연구하였다. 소량의 ZnO를 첨가하여 열전도도가 최대 25%까지 상승하는 결과가 나타났으며, 이 결과로 LED 수명이 증가할 것으로 예상된다. ANSYS 시뮬레이션 결과 열 유속의 값이 ZnO가 첨가된 경우 최대 56% 증가함을 확인할 수 있었다. 실제 LED 패키징을 제작하여 측정한 결과도 ZnO를 첨가한 LTCC 패키징은 $Al_2O_3$로만 이루어진 패키징보다 열저항이 최대 14.9% 감소하였다.

Keywords

References

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