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유체 자가-조립을 위한 버블 항력 연구

Drag Force on Bubbles for Fluidic Self-Assembly

  • 임현승 (한국생산기술연구원 융복합연구부문) ;
  • 이성호 (한국생산기술연구원 융복합연구부문)
  • Im, Hyeon-Seung (Convergent Technology R&D Division, Korea Institute of Industrial Technology) ;
  • Lee, Sung-Ho (Convergent Technology R&D Division, Korea Institute of Industrial Technology)
  • 투고 : 2011.06.13
  • 심사 : 2011.09.09
  • 발행 : 2012.01.01

초록

본 연구는 전통적인 픽-엔-플레이스 방법을 대체하기 위한 새로운 유체 자가-조립 방법을 개발하였다. 이 방법은 종래의 연구보다 경제적이고 효과적인 방법이다. 이를 위해, 중요한 변수인 항력, 모세관 힘, 복원력을 선정하여 이들이 칩과 기판의 부착 및 정렬에 미치는 영향을 알아보기 위해 이론값과 실험값을 비교하였다. 유체 자가-조립 실험에서는 $500{\mu}m$ 솔드 볼에서 96.5% 부착률과 미정렬 $5^{\circ}$ 인 우수한 결과를 도출하였다.

We developed a novel method of fluidic self-assembly to replace the conventional pick-and-place method. This method is cheaper and more effective than the previous method. For this research, we compared mathematical models with experimental results using the parameters of the drag force, the capillary force, and the restoring force for effective chip assembly, and the results for the alignment to the substrate. We obtained a 96.5% attach rate and $5^{\circ}$-misalignment to the substrate in a 500 ${\mu}m$ solder ball.

키워드

참고문헌

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피인용 문헌

  1. NDE Inspections and Simulation of Defects in Composite-Sintered Bushes vol.650, pp.1662-8985, 2013, https://doi.org/10.4028/www.scientific.net/AMR.650.582