Transactions on Electrical and Electronic Materials

  • 제13권6호
  • /
  • Pages.301-304
  • /
  • 2012
  • /
  • 1229-7607(pISSN)
  • /
  • 2092-7592(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지
DOI QR코드

DOI QR Code

Effect of Nanosilica on the Mechanical Properties and AC Electrical Breakdown Strength of Epoxy/Microsilica/Nanosilica Composite

  • Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
  • 투고 : 2012.10.09
  • 심사 : 2012.11.06
  • 발행 : 2012.12.25
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Epoxy/microsilica (65 phr)/nanosilica (0~5 phr) composites (EMNC) were prepared in order to develop a high-voltage insulation material, where phr means parts per hundred relative to the epoxy oligomer. Tensile and flexural tests of the composites were carried out, and the AC electrical breakdown strength was measured, after which all the data were estimated by Weibull statistical analysis. As the nanosilica content increased, the tensile strength increased, and the highest value was 117.7 MPa in the EMNC system with 3 phr nanosilica, which was ca. 10% higher than that of the system without nanosilica. The value then decreased after 3 phr. The flexural strength and AC electrical breakdown strength showed the same tendencies as the tensile strength. The highest value of the flexural strength was 184.6 MPa in the EMNC system with 3 phr of nanosilica, which was ca. 15% higher than that of the system without nanosilica. The strongest value of the AC electrical breakdown strength was 79.0 kV/0.5 mm in the EMNC system with 3 phr of nanosilica, which was ca. 34% higher than that of the system without nanosilica.

키워드

참고문헌

  1. J. Y. Lee, M. J. Shim and S. W. Kim, Polym. Eng. Sci., 39, 1993 (1999) [DOI: http://dx.doi.org/10.1002/pen.11592].
  2. J. Y. Lee and H. K. Lee, Mater. Chem. Phys., 85, 410 (2004) [DOI: http://dx.doi.org/10.1016/j.matchemphys.2004.01.032].
  3. P. O. Henk, T. W. Kortsen and T. Kvarts, High Perform. Polym., 11, 281 (1999) [DOI: http://dx.doi.org/10.1088/0954-0083/11/3/304].
  4. M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagher alavi, M. M. S. Shrazi and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
  5. P. Bajaj, N. K. Jha and A. Kumar, J. Appl. Polym. Sci., 56, 1339 (1995) [DOI: http://dx.doi.org/10.1002/app.1995.070561015].
  6. Y. Xu, D. D. L. Chung and C. Mroz, Composites: Part A, 32, 1749 (2001) [DOI: http://dx.doi.org/10.1016/S1359-835X(01)00023-9].
  7. A. A. Wazzan, H. A. Al-Turaif and A. F. Abdelkader, Polymer- Plastics Technology and Engineering, 45, 1155 (2006) [DOI: http://dx.doi.org/10.1080/03602550600887285].
  8. T. Seckin, A. Gultek, M. G. Icduygu and Y. Onal, J. Appl. Polym. Sci., 84, 164 (2002) [DOI: http://dx.doi.org/10.1002/app.10289].
  9. F. Lin, G. S. Bhatia and J. D. Ford, J. Appl. Polym. Sci., 49, 1901 (1993) [DOI: http://dx.doi.org/10.1002/app.1993.070491105].
  10. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, Intern. Sympos. Electr. Insulating Materials, Kitakyushu, Japan, pp. 239-242, 2005.
  11. R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: http://dx.doi.org/10.1016/j.msea.2006.09.077].
  12. N. Hayakawa, H. Maeda, S. Chigusa and H. Okubo, Cryogenics, 40, 167 (2000) [DOI: http://dx.doi.org/10.1016/s0011-2275(00)00024-2].
  13. G. Iyer, R. S. Gorur, R. Richert, A. Krivda and L. E. Schmidt, IEEE Trans. Dielectr. Electr. Insul., 18, 659 (2011) [DOI: http://dx.doi.org/10.1109/TDEI.2011.5931050].
  14. L. Matejka, J. Lovy, S. Pokorny, K. Bouchal and K. Dusek, J. Polym. Sci.: Part A, 21, 2873 (1983) [DOI: http://dx.doi.org/10.1002/pol.1983. 170211003].
  15. J. J. Park, K. G. Yoon and J. Y. Lee, Trans. Electr. Electron. Mater. 12, 98 (2011) [DOI: http://dx.doi.org/10.4313/TEEM.2011.12.3.98].
  16. J. J. Park, Y. B. Park and J. Y. Lee, Trans. Electr. Electron. Mater. 12, 93 (2011) [DOI: http://dx.doi.org/10.4313/TEEM.2011.12.3.93].
  17. L. A. Dissado, IEEE Transactions on Dielectrics and Electrical Insulation, 9, 483 (2002) [DOI: http://dx.doi.org/10.1109/TDEI.2002.1024425].

피인용 문헌

  1. Development of a high performance high voltage insulator for power transmission lines from blends of polydimethylsiloxane/ethylene vinyl acetate containing nanosilica vol.5, pp.71, 2015, https://doi.org/10.1039/C5RA08277C
  2. The Effects of Water on the Dielectric Properties of Silicon-Based Nanocomposites vol.16, pp.2, 2017, https://doi.org/10.1109/TNANO.2016.2642819