Tribology and Lubricants

  • 제27권3호
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  • Pages.140-146
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  • 2011
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  • 2713-8011(pISSN)
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  • 2713-802X(eISSN)
한국트라이볼로지학회 (Korean Tribology Society)
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마그네틱 파우더 브레이크를 이용한 소형 진자형 충격시험기 개발

Development of a Miniature Pendular Type Impact Testing Machine Using a Magnetic Powder Brake

  • 유인동 (서울과학기술대학교 철도전문대학원) ;
  • 이만석 (서울과학기술대학교 자동차공학과) ;
  • 김호경 (서울과학기술대학교 자동차공학과)
  • You, In-Dong (Graduate School of Railroad, Seoul National University of Science and Technology) ;
  • Lee, Man-Suk (Department of Automotive Engineering, Seoul National University of Science and Technology) ;
  • Kim, Ho-Kyung (Department of Automotive Engineering, Seoul National University of Science and Technology)
  • 투고 : 2011.03.23
  • 심사 : 2011.04.27
  • 발행 : 2011.06.30
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초록

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

키워드

참고문헌

  1. E.H. Wong, S.K.W. Seah, and V.P.W. Shim, "A Review of Board Level Solder Joints for Mobile Applications," Microelectronics Reliability, Vol. 48, pp. 1747-1758, 2008. https://doi.org/10.1016/j.microrel.2008.08.006
  2. JEDEC Standard JESD22-B111, "Board level drop test method of components for handheld electronic products," 2000.
  3. 권용상, 고국종, 김호경, "피에조를 이용한 초소형 단일 솔더볼 연결부의 전단 시험장치 개발," 한국윤활학회지, 제26권, 제1호, pp. 44-51, 2010.
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  6. Q.K Zhang, H.F. Zou, and Z,F. Zhang, "Tensile and Fatigue Behavior of Aged Cu/Sn-4Ag Solder Joint," J Electronic Mat., Vol. 38, No. 6, pp. 852-859, 2009. https://doi.org/10.1007/s11664-009-0769-4