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Trapped Field Analysis of a High Temperature Superconducting Bulk with Artificial Holes

  • Jang, Guneik (Department of Advanced Materials Engineering, Chungbuk National University) ;
  • Lee, Man-Soo (Department of Advanced Materials Engineering, Chungbuk National University) ;
  • Han, Seung-Yong (Francic Bitter Magnet Laboratory, Massachusetts Institute of Technology) ;
  • Kim, Chan-Joong (Superconductor Laboratory, Korea Atomic Energy Research Institute) ;
  • Han, Young-Hee (Green Growth Laboratory, Korea Electric Power Research Institute) ;
  • Park, Byung-Joon (Green Growth Laboratory, Korea Electric Power Research Institute)
  • Received : 2011.03.25
  • Accepted : 2011.04.25
  • Published : 2011.06.30

Abstract

To improve trapped field characteristics of a high temperature superconducting (HTS) bulk, a technique to implement artificial holes has been studied. The artificial holes, filled up with epoxy or metal, may provide better cooling channel and enhance mechanical strength of the HTS bulk. Although many useful researches based on experiments have been reported, a numerical approach is still limited because of several reasons that include: 1) highly non-linear electromagnetic properties of HTS; and 2) difficulty in modeling of randomly scattered "small" artificial holes. In this paper, a 2-D finite element method with iteration is adopted to analyze trapped field characteristics of HTS bulk with artificial holes. The validity of the calculation is verified by comparison between measurement and calculation of a trapped field in a $40{\times}40\;mm$ square and 3.1 mm thick HTS bulk having 16 artificial holes with diameter of 0.7 mm. The effects of sizes and array patterns of artificial holes on distribution of trapped field within HTS bulk are numerically investigated using suggested method.

Keywords

References

  1. M. Tomita and M. Murakami, Nature 421, 517 (2003). https://doi.org/10.1038/nature01350
  2. S. Haindl, F. Hengstberger, H. W. Weber, S. Meslin, J. Noudem, and X. Chaud, Supercond. Sci. Technol. 19, 108 (2006). https://doi.org/10.1088/0953-2048/19/1/018
  3. P. Diko, S. Kracunovska, L. Ceniga, J. Bierlich, M. Zeisberger, and W. Gawalek, Supercond. Sci. Technol. 18, 1400 (2005). https://doi.org/10.1088/0953-2048/18/10/027
  4. N. Lee, G. E. Jang, C. Kim, T. Sung, Y. Han, and S. Jung, Physica C 463, 320 (2007). https://doi.org/10.1016/j.physc.2007.02.053
  5. E. Bartolome, X. Granados, T. Obrados, E. S. Reddy, and S. Kracunovska, IEEE Trans. Appl. Supercond. 15, 2775 (2005). https://doi.org/10.1109/TASC.2005.848210
  6. H. Fujishiro, T. Naito, D. Furuta, and K. Kakehata, Physica C 470, 1181 (2010). https://doi.org/10.1016/j.physc.2010.05.069
  7. S. Hahn, J. H. Kim, C. Koh, and S. Hahn, IEEE Trans. Appl. Supercond 11, 1996 (2001). https://doi.org/10.1109/77.920245
  8. H. Ueda, M. Iwamoto, Y. Kudo, and A. Ishiyama, Electrical Engineering in Japan 159, 44 (2007). https://doi.org/10.1002/eej.20220
  9. R. Gonzalez-Arrabal, M. Eisterer, and H. W. Weber, J. Appl. Phys. 93, 4734 (2004).
  10. M. Tsuchimoto and T. Honma, IEEE Trans. Appl. Supercond. 4, 211 (1994). https://doi.org/10.1109/77.334961