참고문헌
- D. G. Kim, J. W. Kim, S. B. Jung : Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM, Materals Science and Engineering, B 121(2005), 204-210
- T. H. You, Y.S. Kim, W. G. Jung, J.T. Moon, H. M. Choe : Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading, Journal of Alloys and Compounds, 486 (2009), 242-245 https://doi.org/10.1016/j.jallcom.2009.07.085
- F. Cheng, F. Gao, H. Nishikawa, T. Takemoto : Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability, Journal of Alloys and Compounds, 472 (2009), 530-534 https://doi.org/10.1016/j.jallcom.2008.05.017
- J. W. Yoon, B. I. Noh, S. B. Jung : Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu(or Ni)/(Cu or ENIG) solder joints, Journal of Alloys and Compounds, 506 (2010), 331-337 https://doi.org/10.1016/j.jallcom.2010.06.202
- Y.W.Lee, J.P.Jung : A study on the spreadability of Sn-8mass%Zn-3mass%Bi solder with Au plating thickness, Journal of the institute of industrial technology, 14 (2006), 26-29 (in Korean)
- B.Y No, S. B. Jung : Effet of plasma treatment on adhesion strength between underfill and substrate, The Korea institute of metals and materials conference, 2006, 13-15 (in Korean)
- Y. C. Sohn, J. Yu, S.K. Kang, D. Y. Shih, T. Y. Lee : Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection, Electronic components and technology conference, 2005, 83-88
- N. H. Kang, H. S. Na, S. J. Kim, C. Y. Kang : Alloy design of Zn-Al-Cu solder for ultra high temperatures, Journal of alloys and compounds, 467 (2009) 246-250 https://doi.org/10.1016/j.jallcom.2007.12.048
- S. J. Kim, K. S. Kim, S. S. Kim, C. Y. Kang, K. Suganuma : Characteristics of Zn-Al-Cu alloys for high temperature solder application, Materials Transactions, 49-7 (2008), 1531-1536 https://doi.org/10.2320/matertrans.MF200809
- T. Hagihara, T. Takeuchi, Y. Ohno, Fluxless flipchip bonding process using Hydrogen radical, 10th Electronics Packaging Technology conference, 2008, 595-600
- M. Suenaga, T. Kakamori, D. Hirakawa, Y. Ohno, T. Hagihara, J. Kagami, T. Takeuchi : Development of flux-free reflow soldering process using hydrogen radicals, Electronic components and technology conference, 2005, 710-715
- N. Hosoda, T. Suga : C3F8 plasma fluorination of lead free solders for fluxless soldering, Applied surface science, 227 (2004), 81-86 https://doi.org/10.1016/j.apsusc.2003.11.061
-
S. M. Hong, C. S. Kang, J. P. Jung : Flux-free direct chip attachment of solder-bump flip chip by Ar+
$H_2$ plasma treatment, Journal of electronic materials 31-10 (2002) 1104-1111 https://doi.org/10.1007/s11664-002-0049-z - R. Deltshew, D. Hirsch, H. Neumann, T. Herzog, K. J. Wolter, M. Nowottnick, K. Wittke : Plasma treatment for fluxless soldering, Surface and coatings technology, 142-144 (2001), 803-807 https://doi.org/10.1016/S0257-8972(01)01181-1
- Y.T. Chin, P. K. Lam, H. K. Yow, T. Y. Tou : Investigation of mechanical shock testing of leadfree SAC solder joints in fine pitch BGA package, Microelectronics reliability, 48 (2008), 1079-7086 https://doi.org/10.1016/j.microrel.2008.04.003
- W. Liu, N. C. Lee: The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact Reliability of Solder Joints, JOM Journal of the minerals, metals and materials society, 59-7 (2007), 26-31 https://doi.org/10.1007/s11837-007-0085-5
- Y.C. Sohn, J. Yu : Spalling of intermetallic compounds during the reaction between lead-free solders and eletroless Ni-P metallization, 2004 Materials Research Society, 2428-2436
- Seung wook Lee., "Cr, Ni and Cu removal from Si wafer by remote plasma-excited hydrogen." Journal of the Korean Vacuum Society, 10-2 (2001), 267-274
- M. J. Kim, S. Y. Cho, S. H. Kim, J. P. Jung, Lower Temperature Soldering of Capacitor Using Sn-Bi Coated Sn-3.5%Ag Solder, journal of the Korea Welding and Joining Society, 23-3 (2005), 61-67 (in Korean)
- J. H. Park, J. H. Lee, Y. S. Ahn, Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -, journal of the Korea Welding and Joining Society, 25-2 (2007), 37-42 (in Korean) https://doi.org/10.5781/KWJS.2007.25.2.037