Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on fabrication of the Ag fine pattern using Near Field Electro Spinning(NFES)

근접장 전기방사 방식을 이용한 Ag 미세 패턴 형성

  • Sim, Hyo-Sun (Dept. of Electrical &Electronic & Communication Engineering, Korea University of Technology and Education) ;
  • Seo, Hwa-Il (Dept. of Electrical &Electronic & Communication Engineering, Korea University of Technology and Education) ;
  • Youn, Doo-Hyeb (Electronics and Telecommunications Research Institute)
  • 심효선 (한국기술교육대학교 전기.전자.통신공학과) ;
  • 서화일 (한국기술교육대학교 전기.전자.통신공학과) ;
  • 윤두협 (한국전자통신연구원)
  • Received : 2011.11.10
  • Accepted : 2011.12.15
  • Published : 2011.12.31
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Abstract

These days, printed electronics attract attention from electronics industry. In this paper, the fabrication of the fine patterns by Near Field Electro Spinning (NFES) was studied by using Ag ink on silicon wafer (substrate). Two types of ink, the high viscous ink Ag-200 and low viscous ink Ag-15, were used. The fine and uniform patterns were easily fabricated by using Ag-200 because jet breakup is less occurred in high viscosity solution. As increasing flow rate of solution, aspect ratio of Ag pattern decreased. And there was optimum applied voltage for fine pattern. In case of Ag-200, the optimum applied voltage was about 2.02KV. When pattern was fabricated by NFES, the pattern width and height were affected by many factors such as viscosity, flow rate of solution, applied voltage etc.

Keywords

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