Journal of Electrical Engineering and Technology

  • 제6권2호
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  • Pages.270-274
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  • 2011
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  • 1975-0102(pISSN)
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  • 2093-7423(eISSN)
대한전기학회 (The Korean Institute of Electrical Engineers)
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Parameterized Simulation Program with Integrated Circuit Emphasis Modeling of Two-level Microbolometer

  • Han, Seung-Oh (Research Center for Convergence Technology, Hoseo University) ;
  • Chun, Chang-Hwan (Department of Defense Science and Technology, Hoseo University) ;
  • Han, Chang-Suk (Department of Defense Science and Technology, Hoseo University) ;
  • Park, Seung-Man (Department of Defense Science and Technology, Hoseo University)
  • 투고 : 2010.02.27
  • 심사 : 2011.01.17
  • 발행 : 2011.03.01
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초록

This paper presents a parameterized simulation program with integrated circuit emphasis (SPICE) model of a two-level microbolometer based on negative-temperature-coefficient thin films, such as vanadium oxide or amorphous silicon. The proposed modeling begins from the electric-thermal analogy and is realized on the SPICE modeling environment. The model consists of parametric components whose parameters are material properties and physical dimensions, and can be used for the fast design study, as well as for the co-design with the readout integrated circuit. The developed model was verified by comparing the obtained results with those from finite element method simulations for three design cases. The thermal conductance and the thermal capacity, key performance parameters of a microbolometer, showed the average difference of only 4.77% and 8.65%, respectively.

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참고문헌

  1. A. Rogalski, “Infrared detectors: status and trends,” Progress in Quantum Electronics, Vol. 27, pp. 59-210, 2003. https://doi.org/10.1016/S0079-6727(02)00024-1
  2. H.-K. Lee, J.-B. Yoon, E. Yoon, S.-B. Ju, Y.-J. Yong, W. Lee, and S.-G. Kim, “A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures,” IEEE Trans. Elec. Dev., Vol. 46, pp. 1489-1491, 1999. https://doi.org/10.1109/16.772496
  3. C. Chen, X. Yi, J. Zhang, and X. Zhao, “Linear uncooled microbolometer array based on VOx thin films,” Infrared Physics & Tech., Vol. 42, pp. 87-90,2001. https://doi.org/10.1016/S1350-4495(01)00058-5
  4. S. Eminoglu, D. S. Tezcan, M. Y. Tanrikulu, and T. Akin, “Low-cost uncooled infrared detectors in CMOS process,” Sensors & Actuators, Vol. A109, pp. 102-113, 2003.
  5. R. A. Wood, “High performance infrared thermal imaging with monolithic silicon focal planes operating at room temperature,” in Proceedings of IEEE IEDM, 1993.
  6. S. Han, C. Chun, C. Han, and S. Park, “Coupled physics analyses of VOx-based, three-level microbolomter,” Electron. Mater. Lett., Vol. 5, pp. 63-65, 2009. https://doi.org/10.3365/eml.2009.06.063
  7. J. A. Potkay, G. R. Lambertus, R. D. Sacks, and K. D. Wise, “A low-power pressure- and temperatureprogrammable GC column,” in Proceedings of Solid- State Sensor, Actuator and Microsystem Workshop, 2006.
  8. B. E. Cole, R. E. Higashi, and R. A. Wood, “Monolithic arrays of micromachined pixels for infrared applications,” in Proceedings of IEEE IEDM, 1998.
  9. P. W. Kruse and D. D. Skatrud, Uncooled infrared imaging arrays and systems: Academic Press, 1997.
  10. H. H. Jones, S. Aslam, and B. Lakew, “Bolometer simulation using SPICE,” in Proceedings of Int. Thermal Detectors Workshop, 2004.
  11. D. Yvon and V. Sushkov, “Low Noise Cryogenic Electronics: Preamplifier configurations with feedback on the bolometer,” IEEE Trans. Nuclear Sci., Vol. 47, pp. 428-437, 2000. https://doi.org/10.1109/23.846276
  12. J. Shie, Y. Chen, M. Ou-Yang, and B. Chou, “Characterization and modeling of metal-film microbolometer,” J. MEMS, Vol. 5, pp. 298-306, 1996. https://doi.org/10.1109/84.546409
  13. P. Capper and C. T. Elliott, Infrared detectors and emitters: materials and devices, Kluwer Academic Publishers, 2001.

피인용 문헌

  1. Uncooled microbolometer system-level co-simulation using finite element analysis method and intellectual property core vol.23, pp.6, 2017, https://doi.org/10.1007/s00542-016-2907-2
  2. Thermal Characterization of Individual Pixels in Microbolometer Image Sensors by Thermoreflectance Microscopy vol.15, pp.5, 2015, https://doi.org/10.5573/JSTS.2015.15.5.533
  3. High-uniformity post-CMOS uncooled microbolometer focal plane array integrated with active matrix circuit vol.211, 2014, https://doi.org/10.1016/j.sna.2014.01.043
  4. System-level simulation of microbolometer and read-out integrated circuit vol.58, pp.5, 2015, https://doi.org/10.1007/s11431-015-5815-2