Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Analysis of Void Effects on Mechanical Property of BGA Solder Joint

솔더 접합부에 생성된 Void의 JEDEC 규격과 기계적 특성에 미치는 영향

  • 이종근 (성균관대학교 신소재공학과) ;
  • 김광석 (성균관대학교 나노과학기술협동학부) ;
  • 윤정원 (삼성전자 종합기술원) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Received : 2011.12.19
  • Accepted : 2011.12.28
  • Published : 2011.12.30
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Abstract

Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

Keywords

References

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