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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Novel Maskless Bumping for 3D Integration

  • Choi, Kwang-Seong (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Sung, Ki-Jun (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Lim, Byeong-Ok (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Bae, Hyun-Cheol (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Jung, Sung-Hae (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Moon, Jong-Tae (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Eom, Yong-Sung (Convergence Components & Materials Research Laboratory, ETRI)
  • Received : 2009.09.25
  • Accepted : 2009.11.26
  • Published : 2010.04.30
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Abstract

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.

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References

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